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NTT selects Radisys’ Engage Media Server to migrate to Cloud Based Conferencing Services

Keysight’s Edge-to-core Portfolio Selected by Radisys to Create Open Radio Access Network Test Environment

Tallence Selects Radisys’ Engage Platform as Foundation for New Cloud Messaging Solution

Benetel Integrates its Radio Unit with Radisys 5G RAN Software to Enable OpenRAN Deployments

ContactMakers Selects Radisys Engage Media Server to Power Cloud-Based Customer Interaction Suite

Qualcomm and Reliance Jio Align Efforts on 5G

COM Express – Computer-On-Module (COM)

COM Express – Computer-On-Module (COM)

Modules based on COM Express make products smarter, with a standard processor and memory subsystem for embedded applications, while retaining design-level IP on a separate carrier board. This approach lets us collaborate with our customers, providing them with modular building blocks that simplify design challenges. We help manufacturers focus engineering resources on developing differentiating features and avoiding design churn. The COM Experts at Radisys support your design teams with advanced knowledge of what it takes to make a COM design smooth and successful.

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Board Description
CEQM87 Type 6, 95x95mm COM, 4th Gen Intel Core i7 Processor
CEQM77/HM76 Type 6, 95x125mm COM, 3rd Gen Intel Core i7 Processor
CEQM77 ECC Type 6, 95x125mm COM, 3rd Gen Intel Core i7, ECC
CEQM67/HM65 Type 6, 95x125mm COM, 2nd Gen Intel Core i7
CEQM57 Type 2, 95x125mm COM, 1st Gen Intel Core i7
CEQM87HD ECC Type 6, 95x125mm COM, 3rd Gen Intel Core i7, HD, ECC
CEQM77HD ECC Type 6, 95x95mm COM, 4th Gen Intel Core i7 Processor, HD, ECC
CEQM67HD Type 6, 95x125mm COM, 2nd Gen Intel Core i7, -40 to +85C/td>
CR300 COM Express ATX Carrier Board
CR202 ATX Type 2 / Type 3 COM Express Carrier Board
Learn more about the COM Express
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