Type 6, 95x125mm COM, 3rd Gen Intel Core i7, HD, ECC

The CEQM77HD ECC provides extreme ruggedness and -40°C to +85°C temperature range combined with the third generation quad-core Intel Core i7 processor, error-correcting code (ECC) memory,  and the Mobile Intel QM77 Express chipset to provide breakthrough processing performance on a basic size Type 6 COM Express Revision 2.0 module.

The basic size 95mm x 125mm module is ideal for compute-intensive applications requiring ECC memory, such as communications equipment requiring high levels of processing performance, ECC memory and the extended -40C to +85C temperature range.

Radisys delivers the CEQM77HD ECC  module in a COM Express Revision 2.0, Type 6 pin out, enabling customers to take advantage of new technology such as Digital Display Ports while boosting features and performance with up to 16GB memory, additional PCI Express lanes, and improved storage, graphics and audio. The CEQM77HD ECC module provides Trusted Platform Module (TPM) support as well as support for Intel Advanced Management Technology (AMT) enabling remote access and diagnostics via the Radisys Embedded Software Platform (eSP).

The Radisys CE family of COM Express products enable customers to start designing at the same time as processor release, saving months of development time and resources. OEM focus can remain on core competencies such as software and application development rather than high speed circuit design. Planned feature changes, demand fluctuations and performance upgrades can be handled without product re–designs using the CE family. CE modules can reduce service repair inventories, and simplify upgrades, contributing to the success of the product over its lifetime.

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