CEQM77 ECC

Type 6, 95x125mm COM, 3rd Gen Intel Core i7, ECC

The CEQM77 ECC combines 3rd generation quad-core performance Intel Core i7 processor, error-correcting code (ECC) memory and the Mobile Intel QM77 Express chipset with Radisys design expertise to provide breakthrough processing performance on a basic size Type 6 COM Express Revision 2.0 module.

The basic size 95mm x 125mm module is ideal for compute intensive applications such as medical imaging, communications, and test and measurement applications that require ECC memory combined with high levels of processing performance.

Radisys delivers the CEQM77 ECC module in a COM Express Revision 2.0, Type 6 pin out, enabling customers to take advantage of new technology such as Digital Display Ports while boosting features and performance with up to 16GB memory, additional PCI Express lanes, and improved storage, graphics and audio.

The CEQM77 ECC module provides Trusted Platform Module (TPM) support as well as support for Intel Advanced Management Technology (AMT) enabling remote access and diagnostics via the Radisys Embedded Software Platform (eSP).

The Radisys CE family of COM Express products enable customers to start designing at the same time as processor release, saving months of development time and resources. OEM focus can remain on core competencies such as software and application development rather than high speed circuit design. Planned feature changes, demand fluctuations and performance upgrades can be handled without product re–designs using the CE family. CE modules can reduce service repair inventories, and simplify upgrades, contributing to the success of the product over its lifetime.

Additional Specifications

PROCESSORS

Module Specs	Description
CEQM77E-3612-0	Intel Core i7 3612QE / 2.1GHz / 4 Core / 6MB Cache

COM EXPERT DESIGN SERVICES

OEMs can depend on the Radisys COM Expert team to support their design at every stage, from schematic checks to the handling of entire custom carrier and system designs.

Radisys COM Expert services include options for software utilities, custom BIOS, mechanical models, debug assistance and more to customers using Radisys CE processor modules. Design consulting and debug services are also available to support OEM product development at any stage; ask your Radisys Account Executive for more information.

FEATURES

Intel Core i7 and i5 Processor options
- Intel Core i7 3612QE, 2.1GHz
Mobile Intel QM77 Express chipset
Dual–channel DDR3 ECC memory, up to 16GB
Type 6 COM Express Revision 2.0
Basic 95mm x 125mm size
Seven PCI Express x1 ports
One PCI Express x16 PEG port (Gen3)
Three Digital Display Interfaces (DDI)
Single Gigabit Ethernet
8 USB ports, including 4 USB 3.0 ports
TPM and AMT support

SPECIFICATIONS

Feature		Function					Description
Pin-Out		Type					Type 6, 95mm x 125mm
		Compliance					PICMG COM Express R2.0 Basic Form Factor
Processor		3612QE					Core™ i7 3612QE 2.1GHz / 4 Core / 6MB cache / 35W
		Chipset		Mobile Intel® QM77 Express chipset
		Memory		Type				Two 204-pin right-angle SO-DIMM sockets 1600 MT/s, 1333MT/s
				Capacity				16GB maximum, up to 8GB per channel
Flash		16MB system flash for BIOS storage
Video		Intel® Gen 7th integrated graphics engine					LVDS supports 18 bit or 24 bit single/dual channel panel with resolutions up to 1920x1200 pixels at 60 Hz
							VGA with resolutions up to 1920x1200 pixels at 60Hz
							Up to 3 Digital Display Interfaces · DDI 1 (PCH Port B) supports DisplayPort, HDMI or SDVO · DDI 2 (PCH Port C) supports DisplayPort or HDMI · DDI 3 (PCH Port D) supports DisplayPort, HDMI or eDP · The resolutions of DisplayPort can support upto 2560x1600 pixels at 60Hz
		External					One x16 PCI Express interface for external PCIe x16 graphics device,
Networking		Single LAN					One 10/100/1000Base T
Audio			High Definition Audio
			Speaker Out
Ethernet			One 10/100/1000BaseT Giga LAN
Storage			SATA		4 SATA ports supporting both 1.5 and 3.0 Gbps operation Supports RAID 0, 1, 5 and 10 The first two ports supporting 6Gb/s transfer trate
PCI Express			PCI Express x1		Seven PCI Express x1 Ports: Ports 0–3 configurable as one x4, or two x2; or one x2 and two x1; or four x1 ports. Ports 4-6 can be configured as three x1 or one x2 and one x1 ports
			PCI Express x16		One PCI Express x16 Graphics Expansion Port - Configurable as two x8 or one x8 and two x4 ports
USB				Four USB3.0 expansion ports with transfer rate up to 5Gb/s Eight USB 2.0 expansion ports (first four ports combine with USB3.0 ports)
LPC				One LPC interface
TPM				ATMEL AT97SC3204 compliant with TPM1.2
Power				+12 power rail, primary input Supports 9.0V–16.8V power supply
Power Management				ACPI 4.0 supporting states 50, 53, 54, 55 63 and C0, C1, C3, C6, C7 AMT support Intel ME Power States M0, M3, Moff
Miscellaneous				One 100KHz SMBus from PCH
				One 100KHz I2C bus from MCU
				Eight GPIO (four GPI and four GPO)
				Watchdog timer
BIOS	AMI Aptio EFI Firmware
OS	Windows XP®					Embedded Professional 32bit Professional 64bit
	Windows 7					32bit 64bit
	Red Hat Enterprise Linux					32bit 64bit
	Fedora Linux					32bit and 64bit

Physical Specifications

Physical	Dimensions	95mm x 125mm
	Compliance	PICMG COM Express R2.0 Basic Form Factor, Type 6
Environment	Cooling	Forced air	Class EAC1 as defined in the ANSI/VITA 47-2005
		Conduction	Class ECC1 as defined in the ANSI/VITA 47-2005
	Temperature	Operating	Up to 2300m (7500 ft), 0 to 60C Derated -1.1 C per 305 m (1000 ft) above 2300 m (7500 ft)
		Non-operating	-40°C to +85°C
	Shock	Operating	30G, half sine shock pulse, 11ms duration, 3 times per face
		Non-Operating/Unpacked	40G, half sine shock pulse, 11ms duration, 3 times per face (unpackaged)
		Transportation/Packaged	Fixtured assembly: 50G, 17.4 ms trapezoidal pulse Drop test, 10-up bulk packaging, 30in free-fall, one drop on each of six faces
	Vibration (random)	Operating	Random 5Hz to 2KHz, 7.7 grms, 10min in each of 3 axes 5Hz - 20Hz: 0.004g2/Hz ramping up to 0.04g2/Hz 20Hz to 1000Hz: 0.04g2/Hz 1000Hz to 2000Hz: 0.04g2/Hz ramping down to 0.01g2/Hz
		Non-Operating/Storage	Random 5Hz to 2KHz, 9.7 grms, 10min in each of 3 axes 5Hz - 20Hz: 0.006g2/Hz ramping up to 0.06g2/Hz 20Hz to 1000Hz: 0.06g2/Hz 1000Hz to 2000Hz: 0.06g2/Hz ramping down to 0.02g2/Hz
	Humidity	Operating	5% to 95% non-condensing. 95%RH@30C, linear derating to 25%RH@60C
		Non-Operating/Storage	5% to 95% non-condensing
	Altitude	Operating	To 15,000ft (4570m)
		Non-Operating/Storage	To 40,000ft (12000m)
Regulatory	Safety	UL60950-1, EN60950-1, IEC60950-1
		RoHS compliant
	EMC	EN55024, EN55022, and FCC Part 15, Subpart B, Class B

MORE DETAILS

Order Codes:

CEQM77E-3612-0: Core i7-3612QE, 2.1GHz, 2 Core, 6M Cache, HDG3000, TPM, ECC

Supporting Products:

CE-4GB-DDR3E: 4GB DDR3 SODIMM ECC Memory,0C to 60C
CE-8GB-DDR3E: 8GB DDR3 SODIMM ECC Memory, 0C to 60C
CEQM67-AHS: Active Heat Sink
CEQM67-77-HSP: Heatspreader
CEQM67-77-PHSA: Passive Heat Sink
CR300-1: Type 6 COM Express Development Carrier