Latest News:

Radisys Unveils Engage Clarity to Enhance Phone Conversations for People Experiencing Hearing Loss

Boosting Energy Savings with Multi-vendor Hardware and Software Solutions for Cloud Native O-RAN Deployments

Dense Air: Bridging infrastructure and the cloud; shaping the ecosystem of shared wireless services

Radisys Unveils 5G Advanced Wireless Connectivity Software for Industry 4.0 and Private 5G

Radisys Unveils 5G Advanced Wireless Connectivity Software for Industry 4.0 and Private 5G

Radisys to present at MWC Barcelona Feb 26th- 29th, 2024. Visit our NetART showcase at Stand 2D50

Qualcomm

ABOUT Qualcomm

The company that brought cutting edge developments in 3G and 4G is now leading the world to 5G. At Qualcomm, engineers are inventing the technologies of an intelligently connected future, spearheading research efforts for the next global wireless standard, and collaborating with industry leaders to make this future a commercial reality.

Partnership Overview

Radisys has partnered with Qualcomm Technologies Inc. to deliver an integrated, pre-validated and tested solution for Qualcomm FSM9955 chipset, delivering an end-to-end RAN SoC (system on a chipset) targeted for small cells and CBRS deployments. The solution paves the way for faster 5G adoption where RAN densification and network slicing are key requirements.

“Small cell momentum is on the rise and the availability of Radisys’ open sourced 4G RAN software on the FSM platform will further accelerate adoption. We are excited about this addition to the growing small cell ecosystem and the enormous potential it holds for opening new opportunities using technologies such as 3.5 GHz CBRS.”

Irvind Ghai

Vice President, Product Management, Qualcomm Technologies, Inc
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