Type 2, 95x125mm COM, 1st Gen Intel Core i7

The CEQM57 combines the next generation performance Intel Core i5 and i7 processors and the Mobile Intel QM57 Express chipset with Radisys design expertise to provide breakthrough processing performance on a basic size COM Express module.

The compact 95mm x 125mm module is ideal for compute intensive applications such as medical imaging, communications, military–aerospace and test and measurement applications that require high levels of performance.

Radisys delivers the CEQM57 module in a Type 2 and Type 3 pin out, enabling customers to easily upgrade from their previous generation module while boosting features and performance with up to 8GB memory, SSDDR3 options, additional PCI Express lanes, and improved storage, graphics and audio. The CEQM57 module can support error–correcting code (ECC) for applications where memory integrity is required.

The Radisys CE family of COM Express products enable customers to start designing at the same time as processor release, saving months of development time and resources. OEM focus can remain on core competencies such as software and application development rather than high speed circuit design. Planned feature changes, demand fluctuations and performance upgrades can be handled without product re–designs using the CE family. CE modules can reduce service repair inventories, and simplify upgrades, contributing to the success of the product over its lifetime.

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