Radisys Endorses Technology Evolution Of Newly Ratified COM Express 2.0 Specification

Radisys to support legacy designs while assisting customers in a smooth migration to next-generation technology.

HILLSBORO, OR — September 1, 2010 — Radisys® Corporation (NASDAQ: RSYS), a leading provider of innovative hardware and software platforms for next generation IP–based wireless, wireless and video networks, today announced its endorsement of the PICMG Computer–On–Module (COM) Express 2.0 specification. The COM Express 2.0 specification builds on the success of the COM Express 1.0 specification, supporting new interfaces while addressing obsolescence issues with existing interfaces. Applications that will benefit from these new features include transaction terminals, digital signage, medical devices and certain video–intensive applications in the mil/aero market such as radar or imaging equipment.

“Radisys was a founding specification author of the original COM Express 1.0 specification, and was again a leader in the revision process that resulted in the newly adopted and ratified COM Express 2.0 specification,“ said Bob Pebly, Radisys CTO Fellow. “With customers facing unique upgrade paths, Radisys will leverage its breadth of experience with the specification to support our customers, whether they choose to migrate to COM Express 2.0 or stay with their current platforms.”

The COM Express 2.0 specification adds a new module size and two new module Types to the COM Express library. Building on the success of the Basic and Extended module sizes, COM Express 2.0 includes the Compact module size of 95x95mm to reflect the transition toward smaller integrated system–on–a–chip designs and integrated chipsets. The specification also defines the Type 6 and Type 10 modules for more extensive technology upgrades. Type 6 addresses the need for digital display and USB 3.0 interfaces and offers a simple upgrade path for existing Type 2–based designs. Type 10, a single connector version similar to Type 1, optimizes the single connector module display interfaces for future designs. Both new Types are designed to preserve backwards compatibility to the greatest extent possible and provide easy integration with minimal application changes.

The COM Express 2.0 specification can support up to three Digital Display Interfaces, capable of supporting High–Definition Multimedia Interface (HDMI), DisplayPort and SDVO interfaces. The specification also adds support for USB 3.0 while adding two additional PCI Express lanes. Additional interfaces have been incorporated to upgrade audio and digital support and introduce new features such as content protection.

“Embedded applications adopting COM Express are continually pushing the performance paradigm,” noted Pebly. “The initial COM Express specification purposefully planned out a course of I/O interface migration to enable the easy adoption of newer technologies. COM Express 2.0 takes an evolutionary step and defines how to implement and take advantage of newly introduced technology needed by the market, especially in video–rich environments.”

Product Availability

Radisys will add a Type 6 COM Express 2.0 products based on next–generation processor technology to its COM Express product portfolio beginning Q4 2010.

About Radisys

Radisys (NASDAQ: RSYS), a global leader in open telecom solutions, enables service providers to drive disruption with new open architecture business models. Radisys’ innovative disaggregated and virtualized enabling technology solutions leverage open reference architectures and standards, combined with open software and hardware to power business transformation for the telecom industry, while its world-class services organization delivers systems integration expertise necessary to solve communications and content providers’ complex deployment challenges.

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