Type 6, 95x125mm COM, 3rd Gen Intel Core i7 Processor
The CEQM77 combines 3rd generation quad-core performance Intel Core i7 processor and the Mobile Intel QM77 Express chipset with Radisys design expertise to provide breakthrough processing performance on a basic size Type 6 COM Express Revision 2.0 module.
The basic size 95mm x 125mm module is ideal for compute intensive applications such as medical imaging, communications, military–aerospace and test and measurement applications that require high levels of processing performance.
Radisys delivers the CEQM77 module in a COM Express Revision 2.0, Type 6 pin out, enabling customers to take advantage of new technology such as Digital Display Ports while boosting features and performance with up to 16GB memory, additional PCI Express lanes, and improved storage, graphics and audio. The CEQM77 module provides Trusted Platform Module (TPM) support as well as support for Intel Advanced Management Technology (AMT) enabling remote access and diagnostics via the Radisys Embedded Software Platform (eSP).
The Radisys CE family of COM Express products enable customers to start designing at the same time as processor release, saving months of development time and resources. OEM focus can remain on core competencies such as software and application development rather than high speed circuit design. Planned feature changes, demand fluctuations and performance upgrades can be handled without product re–designs using the CE family. CE modules can reduce service repair inventories, and simplify upgrades, contributing to the success of the product over its lifetime.
| Module Specs | Description | Compare Modules |
| CEQM77-3615-0 | Intel Core i7 3615QE / 2.3GHz / 4 Core / 6MB Cache | |
| CEQM77-3612-0 | Intel Core i7 3612QE / 2.1GHz / 4 Core / 6MB Cache |
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| CEQM77-3555-0 | Intel Core i7 3555LE / 2.5GHz / 2 Core / 3MB Cache |
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| CEQM77-3517-0 | Intel Core™ i7 3517UE / 1.7Ghz / 2 Core / 4MB Cache |
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| CEQM77-3610-0 | Intel Core™ i5 3610ME / 2.7GHz / 4 Core / 3MB Cache |
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| Compare All | ||
OEMs can depend on the Radisys COM Expert team to support their design at every stage, from schematic checks to the handling of entire custom carrier and system designs.
Radisys COM Expert services include options for software utilities, custom BIOS, mechanical models, debug assistance and more to customers using Radisys CE processor modules. Design consulting and debug services are also available to support OEM product development at any stage; ask your Radisys Account Executive for more information.
- Intel Core i7 and i5 Processor options
- Intel Core i7 3615QE processor, 2.3 GHz
- Intel Core i7 3612QE, 2.1GHz
- Intel Core i7 3555LE, 2.5GHz
- Intel Core i7 3517, 1.7GHz
- Intel Core i5 3610, 2.7GHz
- Mobile Intel QM77 Express chipset
- Dual–channel DDR3, up to 16GB
- Type 6 COM Express Revision 2.0
- Basic 95mm x 125mm size
- Seven PCI Express x1 ports
- One PCI Express x16 PEG port (Gen3)
- Three Digital Display Interfaces (DDI)
- Single Gigabit Ethernet
- 8 USB ports, including 4 USB 3.0 ports
- TPM and AMT support
- Four USB3.0 ports compliant with USB3.0 standard
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Feature |
Function |
Description |
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Pin-Out |
Type |
Type 6, 95mm x 125mm |
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Compliance |
PICMG COM Express R2.0 Basic Form Factor |
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Processor |
3615QE |
Core™ i7 3615QE 2.3GHz / 4 Core / 6MB cache / 45W |
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3612QE |
Core™ i5 3612QE 2.1GHz / 4 Core / 6MB cache / 35W |
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3555LE |
Core™ i7 3555LE 2.5GHz / 2 Core / 4MB cache / 25W |
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3517UE |
Core™ i7 3517UE 2.7GHz / 2 Core / 4MB cache / 17W |
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3610ME |
Core™ i5 3610ME 2.7GHz / 2 Core / 3MB cache / 35W |
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Chipset |
Mobile Intel® QM77 Express chipset |
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Memory |
Type |
Two 204-pin right-angle SO-DIMM sockets 1600 MT/s, 1333MT/s |
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Capacity |
16GB maximum, up to 8GB per channel |
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Flash |
16MB system flash for BIOS storage |
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Video |
Intel® Gen 7th integrated graphics engine |
LVDS supports 18 bit or 24 bit single/dual channel panel with resolutions up to 1920×1200 pixels at 60 Hz |
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VGA with resolutions up to 1920×1200 pixels at 60Hz |
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Up to 3 Digital Display Interfaces |
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External |
One x16 PCI Express interface for external PCIe x16 graphics device, |
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Networking |
Single LAN |
One 10/100/1000Base T |
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Audio |
High Definition Audio |
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Speaker Out |
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Ethernet |
One 10/100/1000BaseT Giga LAN |
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Storage |
SATA |
4 SATA ports supporting both 1.5 and 3.0 Gbps operation |
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PCI Express |
PCI Express x1 |
Seven PCI Express x1 Ports:
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PCI Express x16 |
One PCI Express x16 Graphics Expansion Port – Configurable as two x8 or one x8 and two x4 ports |
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USB |
Four USB3.0 expansion ports with transfer rate up to 5Gb/s |
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LPC |
One LPC interface |
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TPM |
ATMEL AT97SC3204 compliant with TPM1.2 |
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Power |
+12 power rail, primary input |
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Power Management |
ACPI 4.0 supporting states 50, 53, 54, 55 63 and C0, C1, C3, C6, C7 |
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Miscellaneous |
One 100KHz SMBus from PCH |
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One 400KHz I2C bus from MCU |
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Eight GPIO (four GPI and four GPO) |
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Watchdog timer |
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BIOS |
AMI Aptio EFI Firmware |
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OS |
Windows XP® |
Embedded |
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Windows 7 |
32bit |
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Red Hat Enterprise Linux |
32bit |
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Fedora Linux |
32bit and 64bit |
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Physical Specifications
| Physical | Dimensions | 95mm x 125mm | |
| Compliance | PICMG COM Express R2.0 Basic Form Factor, Type 6 | ||
| Environment | Cooling | Forced air | Class EAC1 as defined in the ANSI/VITA 47-2005 |
| Conduction | Class ECC1 as defined in the ANSI/VITA 47-2005 | ||
| Temperature | Operating |
Up to 2300m (7500 ft), 0 to 60C Derated -1.1 C per 305 m (1000 ft) above 2300 m (7500 ft) |
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| Non-operating | -40°C to +85°C | ||
| Shock | Operating | 30G, half sine shock pulse, 11ms duration, 3 times per face | |
| Non-Operating/Unpacked | 40G, half sine shock pulse, 11ms duration, 3 times per face (unpackaged) | ||
| Transportation/Packaged |
Fixtured assembly: 50G, 17.4 ms trapezoidal pulse Drop test, 10-up bulk packaging, 30in free-fall, one drop on each of six faces |
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Vibration (random) |
Operating |
Random 5Hz to 2KHz, 7.7 grms, 10min in each of 3 axes 5Hz – 20Hz: 0.004g2/Hz ramping up to 0.04g2/Hz 20Hz to 1000Hz: 0.04g2/Hz 1000Hz to 2000Hz: 0.04g2/Hz ramping down to 0.01g2/Hz |
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| Non-Operating/Storage |
Random 5Hz to 2KHz, 9.7 grms, 10min in each of 3 axes 5Hz – 20Hz: 0.006g2/Hz ramping up to 0.06g2/Hz 20Hz to 1000Hz: 0.06g2/Hz 1000Hz to 2000Hz: 0.06g2/Hz ramping down to 0.02g2/Hz |
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| Humidity | Operating |
5% to 95% non-condensing. 95%RH@30C, linear derating to 25%RH@60C |
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| Non-Operating/Storage | 5% to 95% non-condensing | ||
| Altitude | Operating | To 15,000ft (4570m) | |
| Non-Operating/Storage | To 40,000ft (12000m) | ||
| Regulatory | Safety | UL60950-1, EN60950-1, IEC60950-1 | |
| RoHS compliant | |||
| EMC | EN55024, EN55022, and FCC Part 15, Subpart B, Class B | ||
Order Codes:
- CEQM77-3615-0: Core i7-3615QE, 2.3GHz, 4 Core, 6M Cache, HDG3000, TPM
- CEQM77-3612-0: Core i7-3612QE, 2.1GHz, 2 Core, 6M Cache, HDG3000, TPM
- CEQM77-3555-0: Core i7-3555LE, 2.7GHz, 2 Core, 4M Cache, HDG3000, TPM
- CEQM77-3517-0: Core i7-3517UE, 1.5GHz, 2 Core, 4M Cache, HDG3000, TPM
- CEQM77-3610-0: Core i5-3610ME, 1.7GHz, 2 Core, 3M Cache, HDG3000, TPM
Supporting Products:
- CE-2GB-DDR3: 2GB DDR3 SODIMM Memory
- CE-4GB-DDR3: 4GB DDR3 SODIMM Memory
- CE-8GB-DDR3: 8GB DDR3 SODIMM Memory
- CEQM67-77-AHS: Active Heat Sink
- CEQM67-77-HSP: Heatspreader
- CEQM67-77-PHSA: Passive Heat Sink
- CR300: Type 6 COM Express Development Carrier
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