Type 6, 95x125mm COM, 2nd Gen Intel Core i7, -40 to +85C
The CEQM67HD provides extreme ruggedness and -40°C to +85°C temperature range combined with the second generation quad-core Intel Core i7 processor and the Mobile Intel QM67 Express chipset to provide breakthrough processing performance on a basic size Type 6 COM Express Revision 2.0 module.
The basic size 95mm x 125mm module is ideal for compute intensive applications such as defense and aerospace communications, processing, test and control that require high levels of processing performance.
Radisys delivers the CEQM67HD module in a COM Express Revision 2.0, Type 6 pin out, enabling customers to take advantage of new technology such as Digital Display Ports while boosting features and performance with up to 16GB memory, additional PCI Express lanes, and improved storage, graphics and audio. The CEQM67HD module provides (Trusted Platform Module) TPM support as well as support for Intel Advanced Management Technology (AMT) enabling remote access and diagnostics via the Radisys Embedded Software Platform (eSP).
The Radisys COM Express (CE) family of products enables customers to start designing at the same time as processor release, saving months of development time and resources. OEM focus can remain on core competencies such as software and application development rather than high speed circuit design. Planned feature changes, demand fluctuations and performance upgrades can be handled without product redesigns using the CE family. CE modules can reduce service repair inventories, and simplify upgrades, contributing to the success of the product over its lifetime.
| Module Specs | Description | Compare Modules |
| CEQM67HD-2715-0 | Intel Core i7 2715QE / 2.1GHz / 4 Core / 6MB Cache |
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| CEQM67HD-2655-0 | Intel Core i7 2655LE / 2.2GHz / 2 Core / 4MB Cache |
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| CEQM67HD-2515-0 | Intel Core i5 2515QE / 2.5GHz / 2 Core / 3MB Cache |
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| Compare All | ||
OEMs can depend on the Radisys COM Expert team to support their design at every stage, from schematic checks to the handling of entire custom carrier and system designs.
Radisys COM Expert services include options for software utilities, custom BIOS, mechanical models, debug assistance and more to customers using Radisys CE processor modules. Design consulting and debug services are also available to support OEM product development at any stage. Ask your Radisys Account Executive for more information.
- -40°C to +85°C operating temperature
- Intel Core i7 Processor options
- Intel Core i7 2715QE processor, 2.1 GHz
- Intel Core i7 2655LE, 2.2GHz
- Intel Core i5 2515E, 1.5GHz
- Mobile Intel QM67 Express chipset
- Dual-channel DDR3, up to 16GB
- Type 6 COM Express Revision 2.0
- Basic 95mm x 125mm size
- Seven PCI Express x1 ports (may be used in x4, x2 configurations)
- One PCI Express x16 PEG port (may be used in x8, x4 configurations)
- Three Digital Display Interfaces (DDI)
- Single Gigabit Ethernet
- TPM and AMT support
- One serial port
| Feature | Function | Description |
| Pin-Out | Type | Type 6, 95mm x 125mm |
| Compliance | PICMG COM Express R2.0 Basic Form Factor | |
| Processor | 2715QE | Core i7 2715QE 2.1GHz / 6MB cache / 45W |
| 2655LE | Core i7 2655LE 2.2GHz / 4MB cache / 25W | |
| 2515E | Core i5 2515E 1.5GHz / 4MB cache / 17W | |
| Chipset | Mobile Intel QM67 Express chipset | |
| Memory | Type | Two 204-pin right-angle SO-DIMM sockets, 1333MT/s and 1067MT/s |
| Capacity | Up to 8GB per channel, for a maximum of 16GB memory | |
| Flash | 8MB system flash for BIOS storage | |
| Video | Intel Gen 6.0 integrated graphics engine | LVDS supports 18 bit or 24 bit panel, single- or dual-channel, supports resolutions up to 1920×1200 pixels at 60 Hz |
| VGA | ||
Up to 3 Digital Display Interfaces
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| External | One x16 PCI Express interface for external PCIe x16 graphics device, | |
| Networking | Single Lan | One 10/100/1000BaseT |
| Audio | High Definition Audio | |
| Speaker Out | ||
| Storage | SATA | 4 SATA ports supporting 1.5 and 3.0 Gbps operation, Ports 0 and 1 supprt 6Gbps (SATA3) Supports RAID 0, 1, 5 and 10 |
| PCI Express | PCI Express x1 | Seven PCI Express x1 Ports:
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| PCI Express x16 | One PCI Express x16 Graphics Expansion Port
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| USB | Eight USB 2.0 expansion ports | |
| LPC | One LPC interface | |
| TPM | ATMEL AT97SC3204 | |
| Power | +12 power rail, primary input Supports 9.0V–16.8V power supply |
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| Power Management | ACPI 4.0 supporting states 50, 53, 54, 55 63 and C0, C1, C3, C6, C7 AMT support Intel ME Power States M0, M3, Moff |
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| Miscellaneous | One 100KHz SMBus from PCH | |
| One 400KHz I2C bus from MCU | ||
| Eight GPIO (four GPI and four GPO) | ||
| Watchdog timer | ||
| Serial port | ||
| BIOS | AMI EFI Firmware | |
| OS | Windows XP | Embedded Professional 32bit Professional 64bit |
| Windows Embedded Standard 7 | 32bit 64bit |
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| Red Hat Enterprise Linux 6.0 | 32bit 64bit |
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| Fedora Linux 15.0 | 32bit and 64bit | |
Physical Specifications
| Physical | Dimensions | 95mm x 125mm | |
| Compliance | PICMG COM Express R2.0 Basic Form Factor, Type 6 | ||
| Environment | Temperature | Operating | Up to 2300m (7500 ft), -40°C to +85°C Derated -1.1 C per 305 m (1000 ft) above 2300 m (7500 ft) |
| Non-operating | -40°C to +85°C | ||
| Shock | Operating | 40G, half sine shock pulse, 11ms duration, 3 times per face | |
| Non-Operating/Unpacked | 50G, half sine shock pulse, 11ms duration, 3 times per face (unpackaged) | ||
| Transportation/Packaged | Drop test, 10-up bulk packaging, 30in free-fall, one drop on each of six faces | ||
| Vibration (random) |
Operating | Random 5Hz to 2KHz, 12.07 grms, 1hour in each of 3 axes 5Hz – 40Hz: 0.04g2/Hz 40Hz to 100Hz: 0.04g2/Hz ramping up to 0.1g2/Hz (3dB/Oct) 100Hz to 1000Hz: 0.1g2/Hz 1000Hz to 2000Hz: 0.1g2/Hz ramping down to 0.025g2/Hz (6dB/Oct) |
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| Non-Operating/Storage | Random 5Hz to 2KHz, 12.07 grms, 1hr in in each of 3 axes 5Hz – 40Hz: 0.04g2/Hz 40Hz – 100Hz: 0.04g2/Hz ramping up to 0.1g2/Hz (3dB/oct) 100Hz to 1000Hz: 0.1g2/Hz 1000Hz to 2000Hz: 0.1g2/Hz ramping down to 0.025g2/Hz (6dB/oct) 5-500 Hz swept sine, 2.5 g (0-p), 25.4mm(p-p) MAX displacement, 5 min dwell at 3 resonances in each of 3 axes. |
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| Humidity | Operating | 5% to 95% non-condensing. 95%RH@30C, linear derating to 25%RH@85C | |
| Non-Operating/Storage | 5% to 95% non-condensing | ||
| Altitude | Operating | To 15,000ft (4570m) | |
| Non-Operating/Storage | To 40,000ft (12000m) | ||
| Regulatory | Safety | UL60950-1, EN60950-1, IEC60950-1 | |
| RoHS compliant | |||
| EMC | EN55024, EN55022, and FCC Part 15, Subpart B, Class B | ||
| Warranty | Standard | Two years, parts only | |
Order Codes:
- CEQM67HD-2715-0: Corei7-2715QE, 2.1GHz, 4 Core, 6M Cache, HDG3000,TPM, -40c to 85c
- CEQM67HD-2655-0: Corei7-2655LE, 2.2GHz, 2 Core, 4M Cache, HDG3000, TPM, -40c to 85c
- CEQM67HD-2610-0: Corei5 2515E, 1.5GHz, 2 Core, 4M Cache, HDG3000, TPM, -40c to 85c
Supporting Products:
- CE–2GB–DDR3IT: 2GB DDR3 SODIMM Memory, -40C to +80C
- CE–4GB–DDR3IT: 2GB DDR3 SODIMM Memory, -40C to +80C
- CE–8GB–DDR3IT: 8GB DDR3 SODIMM Memory, -40C to +80C
- CEQM67-77-AHS: Active Heat Sink
- CEQM67-77-HSP: Heatspreader
- CEQM67-77-PHSA: Passive Heat Sink
- CR300: Type 6 COM Express Development Carrier
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