Type 2, 95x125mm COM, Intel Core 2 Duo
The CEGM45 combines the next generation performance Intel Core 2 Duo processors and the GM45/GS45 chipsets with Radisys designed dual channel memory to provide breakthrough processing performance on a basic size COM Express module.
The compact 95mm x 125mm module is ideal for processing intensive applications such as medical or machine imaging and high end test and measurement or gaming.
Featuring DDR3 memory, enhanced 3D graphics, and a microSD socket, the CEGM45 is available in both Type 2 and Type 3 COM Express pin-out options. The CEGM45 supports existing and new carrier designs while maximizing feature content.
The Radisys CE family of COM Express products enable customers to start designing at the same time as processor release, saving months of development time and resources. OEM focus can remain on core competencies such as software and application development rather than high speed circuit design. Planned feature changes, demand fluctuations and performance upgrades can be handled without product re-designs using the CE family. CE modules can reduce service repair inventories, and simplify upgrades, contributing to the success of the product over its lifetime.
Kickstart Your Application Development with COM Express Starter Kits
Accelerate a product’s development, improve its time to market and reduce overall cost by minimizing the design team’s installation requirements and maximizing their efficiency.
COM Express Starter Kits arrive integrated onto a CR202 or CR203 development carrier board with heatsink, memory modules, hard drive, DVD drive, and power supply–all using only a single order code.
OEMs can depend on the Radisys COM Expert team to support their design at every stage, from schematic checks to the handling of entire custom carrier and system designs.
Radisys COM Expert services include options for software utilities, custom BIOS, mechanical models, debug assistance and more to customers using Radisys CE processor modules. Design consulting and debug services are also available to support OEM product development at any stage. Ask your Radisys Sales Manager for more information.
- Intel Core 2 Duo and Intel Celeron M processor options
- 2.53GHz Intel Core 2 Duo T9400
- 2.26GHz Intel Core 2 Duo P8400
- 1.9GHz Intel Celeron M T3100
- 2.26GHz Intel Core 2 Duo SP9300
- 1.86GHz Core 2 Duo SL9400
- GM45 Express chipset and ICH9-M
- Dual-channel DDR3, up to 8GB
- Type 2 pinout
- On-board microSD socket
| Feature | Function | Description |
|---|---|---|
| Pin-Out | Type | Type 2, 95mm x 125mm |
| Compliance | PICMG COM Express R1.0 Basic Form Factor | |
| Processor | T9400 Type 2 | 2.53 GHz Intel Core 2 Duo / 6MB Cache / 1067MHz FSB/ 35W |
| P8400 Type 2 | 2.26 GHz Intel Core 2 Duo / 3MB Cache / 1067MHz FSB/ 35W | |
| T3100 Type 2 | 1.9GHz Intel Celeron M / 1MB Cache / 800MHz FSB/ 35W | |
| SP9300 Type 2 | 2.26 GHz Intel Core 2 Duo / 6MB Cache / 1067MHz FSB/ 25W | |
| SU9300 Type 2 | 1.2 GHz Intel Core 2 Duo / 3MB Cache / 800MHz FSB/ 10W | |
| SL9400 Type 2 | 1.86 GHz Intel Core 2 Duo SV / 6MB Cache / 1067MHz FSB /17W | |
| Chipset | Intel GM45/GS45 Express Chipsets and ICH9M I/O Hub | |
| Memory | Type | Two 204-pin right-angle SO-DIMM sockets for DDR3-1067 and DDR3-800 |
| Capacity | Up to 4GB per channel, for a maximum of 8GB memory | |
| Flash | 4MB system flash for BIOS storage | |
| Video | Intel Gen 5.0 integrated graphics engine | Dual LVDS supports 2 x 18 bpp OR 2 x 24 bpp panel support |
| VGA | ||
| Default Output: SDTV/Standard Definition TV Also Supported: Composite, S-Video, Component Video, HDTV |
||
| Dual-channel SDVO, multiplexed on the PCI Express Graphic port display interface | ||
| Three DisplayPort, multiplexed on the PCI Express Graphic port display interface | ||
| External | One PCI Express x16 Graphics expansion port | |
| Networking | Type 2 | One 10/100/1000BaseT |
| Audio | High Definition Audio | |
| Speaker Out | ||
| Storage | SATA | Four SATA interfaces, each capable of supporting one SATA device Supports both 1.5 and 3.0 Gbps operation |
| IDE (type 2 only) | One IDE interface (build option) capable of supporting two UltraATA/100 devices | |
| USB | microSD socket (not available on T9400) | |
| PCI Express | Type 2 | One x16 PCI Express Graphics expansion port |
| Type 2 | One PCI Express x1 interface and Four x1 PCI Express link expansion ports, configurable as:
|
|
| PCI | One PCI 2.3 compliant 32-bit, 33MHz bus | |
| USB | Eight USB 2.0 expansion ports USB 2.0 Debug Port on port 0 |
|
| LPC | One LPC interface | |
| Power | +12 power rail, primary input Supports 6.0V-16.8V (SL9400, SP9300, SU9300, ICP722) Supports 6.0V-15.5V (T9400 only) |
|
| Power Management | ACPI 3.0 supporting states S0, S3, S4, S5, G3, and C0, C1, C2, C3, C4/C4E | |
| Miscellaneous | One SMBus | |
| One I2C | ||
| Eight GPIO (four GPI and four GPO) | ||
| BIOS | Phoenix EmbeddedBIOS with StrongFrame Technology | |
| OS | Windows XP Embedded | |
| Windows XP Professional | ||
| Windows Vista Ultimate Edition | ||
| Red Hat Embedded Linux | ||
| Radisys Microware OS-9 | ||
| Microware Hypervisor | ||
Physical Specifications
| Physical | Dimensions | 95mm x 125mm | |
| Compliance | PICMG COM Express R1.0 Basic Form Factor | ||
| Environment | Cooling | Forced air | Class EAC1 as defined in the ANSI/VITA 47-2005 |
| Conduction | Class ECC1 as defined in the ANSI/VITA 47-2005 | ||
| Temperature | Operating | Up to 2300m (7500 ft), 0 to 60C Derated -1.1 C per 305 m (1000 ft) above 2300 m (7500 ft) Note: This Spec is based on the SKU of CEGM45T2-T94 with CEGM45-AHS. |
|
| Non-operating | -40°C to +85°C | ||
| Shock | Operating | 30G, half sine shock pulse, 11ms duration, 3 times per face | |
| Non-Operating/Unpacked | 40G, half sine shock pulse, 11ms duration, 3 times per face (unpackaged) | ||
| Transportation/Packaged | Fixtured assembly: 50G, 17.4 ms trapezoidal pulse Drop test, 10-up bulk packaging, 30in free-fall, one drop on each of six faces |
||
| Vibration (random) |
Operating | Random 5Hz to 2KHz, 7.7 grms, 10min in each of 3 axes 5Hz – 20Hz: 0.004g2/Hz ramping up to 0.04g2/Hz 20Hz to 1000Hz: 0.04g2/Hz 1000Hz to 2000Hz: 0.04g2/Hz ramping down to 0.01g2/Hz |
|
| Non-Operating/Storage | Random 5Hz to 2KHz, 9.7 grms, 10min in each of 3 axes 5Hz – 20Hz: 0.006g2/Hz ramping up to 0.06g2/Hz 20Hz to 1000Hz: 0.06g2/Hz 1000Hz to 2000Hz: 0.06g2/Hz ramping down to 0.02g2/Hz |
||
| Humidity | |||
| Operating | 5% to 95% non-condensing. 95%RH@30C, linear derating to 25%RH@60C | ||
| Non-Operating/Storage | 5% to 95% non-condensing | ||
| Altitude | |||
| Operating | To 15,000ft (4570m) | ||
| Non-Operating/Storage | To 40,000ft (12000m) | ||
| Regulatory | Safety | UL60950-1, EN60950-1, IEC60950-1 | |
| Shall meet RoHS at time of production | |||
| EMC | EN55024, EN55022, and FCC Part 15, Subpart B, Class B | ||
| Warranty | Standard | Two years, parts only | |
Module Order Codes
- CEGM45T2-T94-0: Type 2, 2.53GHz Core 2 Duo T9400
- CEGM45T2-P84-0: Type 2, 2.26GHz Core 2 Duo P8400
- CEGM45T2-T31-0: Type 2, 1.96GHz Celeron M T3100
- CEGM45T2-SL9-0: Type 2, 1.86GHz Core 2 Duo SL9400
- CEGM45T2-SP9-0: Type 2, 2.26GHz Core 2 Duo SP9300
- CEGM45T2-SU9-0: Type 2, 1.2GHz Core 2 Duo SU9300
Supporting Products
- CR202-PCIE16: Type 2, ATX development carrier, PCI Express x16
- CEGM45R1-PHS: CEGM45 passive heatsink assembly
- CEGM45R1-AHS: CEGM45 active heatsink assembly
- CEGM45R2-PHS: CEGM45 passive heatsink assembly
- CEGM45R2-AHS: CEGM45 active heatsink assembly
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