Radisys Partners With IFTEST To Provide Customized COM Express Carrier Boards For Medical And Industrial Applications

Radisys Alliance Partner Program collaboration ensures customers short, cost efficient development cycles.

HILLSBORO, OR – February 24, 2010 – Radisys® Corporation (NASDAQ: RSYS), a leading global provider of application–ready software and hardware platforms, today announced that IFTEST joined the Radisys Alliance Partner Program (RAPP) as a Gold member to deliver customized COM Express carrier boards for the medical and industrial markets. Radisys’ COM Express processor modules enable breakthrough processing performance, while IFTEST provides custom carrier design services, including production, verification and testing. The collaboration between Radisys and IFTEST means medical and industrial customers can now tap into the combined expertise of two industry–leading companies to leverage a customized carrier board that meets their application requirements, without having to devote precious resources to in–house development.

“In today’s competitive landscape, original equipment manufacturers do not have the time built into their aggressive time–to–market schedules to combine a processor module with a custom carrier board in–house,” said Keate Despain, Senior Director, Commercial Business Unit, Radisys. “IFTEST brings a deep understanding of the requirements of the medical and industrial markets to our already robust RAPP program, enabling us to save our customers months of design and development time by streamlining their development cycle.”

Radisys’ COM Express solutions are the ideal processor module for IFTEST custom carrier boards, offering a wide range of choice to meet a customer’s unique price and performance goals. In addition to designing and integrating the Radisys processing module onto custom carrier boards, IFTEST also has a deep understanding of the complex certification requirements of the medical and industrial markets.

“There are many complex facets in the design process of a customized carrier board for the medical and industrial markets,” said Werner Kunz, Sales and Marketing at IFTEST. “Radisys’ COM Express product line allows our customers to select the ideal processing module and carrier features for the unique size, temperature and power requirements of their customized application. Through a formal RAPP partnership, our customers benefit from a smooth development cycle, saving them from costly design turns that they would face in creating a production–level carrier board on their own.”

Radisys and IFTEST will showcase their solutions at Embedded World 2010, March 2–4 in Nuremberg, Germany, in the IFTEST Booth #9–244.

Radisys Alliance Partner Program

The Radisys Alliance Partner Program provides original equipment manufacturer customers with the broadest portfolio of standards–based building blocks in the industry that deliver choice and flexibility while significantly reducing development risk, time–to–market and cost. The breadth and depth of the Radisys ecosystem results in solutions that not only address the underlying technological issues associated with migration to next–generation platforms, but also address the business and service model requirements between partners delivering a comprehensive solution. Participants in RAPP include providers of solutions, application–specific stacks, silicon, hardware building blocks, operating systems and middleware as well as channel distributors and pre–sale and after–sale service providers.

About Radisys

Radisys (NASDAQ: RSYS) is a leading provider of embedded wireless infrastructure solutions for telecom, aerospace, defense and public safety applications. Radisys’ market-leading ATCA, IP Media Server and COM Express platforms coupled with world-renowned Trillium software, services and market expertise enable customers to bring high-value products and services to market faster with lower investment and risk. Radisys solutions are used in a wide variety of 3G & 4G / LTE mobile network applications including: Radio Access Networks (RAN) solutions from femtocells to picocells and macrocells, wireless core network applications, Deep Packet Inspection (DPI) and policy management; conferencing and media services including voice, video and data, as well as customized mobile network applications that support the aerospace, defense and public safety markets.

Radisys, Continuous Computing and Trillium are registered trademarks of Radisys Corporation.