Radisys Drives High Performance For Intense-Compute Applications With New CEQM57 COM Express Module

COM Express Module Based on Intel® Core™ i5 and i7 Processors and Mobile Intel® QM57 Express Chipset.

HILLSBORO, OR — January 7, 2010 — Radisys® Corporation (NASDAQ: RSYS), a leading global provider of embedded solutions for telecommunications, medical and other industries, today announced the release of its Procelerant™ CEQM57 COM Express module, utilizing the new Intel® Core™ i5 and i7 processors and the Mobile Intel® QM57 Express chipset. The CEQM57 COM Express high performance module features improved PCI Express bandwidth, graphics, storage and security features that directly impact compute intensive applications. These modules are ideally suited for medical imaging, communications, military-aerospace and test and measurement applications that require high levels of performance. Radisys will deliver the CEQM57 module in a Type 2 and Type 3 pin-out, enabling customers to easily upgrade from their previous generation module. In addition, the CEQM57 module can support error-correcting code (ECC) for applications where memory integrity is critical. By releasing the CEQM57 COM Express Module in lock-step with the Intel® Core™ i5 and i7 processors and Mobile Intel® QM57 Express chipset, Radisys enables design engineers to save months of development time and reduce overall time-to-market.

“Our customers have come to depend on Radisys to be out in the market early with the highest performing COM Express modules based on new processing technology, saving them critical development time in their efforts to roll-out new products,” said Keate Despain, Radisys Sr. Director, Commercial Business Unit. “Because of our unmatched expertise in high performance COM Express modules, Radisys can also deliver innovative new features, keeping our customers ahead of the technology curve.”

The CEQM57 is based on the latest, smartest and fastest Intel processing technology that delivers intelligent performance and energy efficiency for a multitude of applications. The CEQM57 supports the Intel® Core™ i7 processors at 2.53 GHz, 2.0 GHz and 1.06 GHz and the Intel® Core™ i5 processor at 2.4 GHz. By utilizing the processing power of the Intel® Core™ processor family, Radisys can deliver the highest performance COM Express modules in addition to low power module options.

Radisys Procelerant™ CEQM57

The new Procelerant™ CEQM57 COM Express module delivers the highest performance available in a basic 125mm x 95mm form factor. It supports both single and dual LAN, dual channel DDR3 SO-DIMMs (non-ECC) and up to 8GB memory, SSDDR3 options, and includes expanded support for PCI Express, storage, graphics and audio. In addition, the CEQM57 module utilizes UEFI (Unified Extensible Firmware Interface), reducing OEM design and development time by enabling quick BIOS customizations, new features, and re-use of BIOS enhancements. Operating system support is available for Windows XP, Windows Vista, Windows 7, Red Hat Linux and Microware Hypervisor.

Key Features

  • Basic 125mm x 95mm COM Express module based on the Intel® Core™ i5 and i7 processors and the Mobile Intel® QM57 Express chipset
  • COM Express 1.0 Type 2 and Type 3 pin-outs ensures smooth upgrades
  • SSDDR (Solid State Disk on SODIMM form factor) enabling up to 32 GB NAND flash memory or up to 8 GB DDR3 memory
  • ECC memory option for critical memory applications
  • Six PCI Express x1 ports, one PCI Express x8 port, and optional PCI Express x16 expansion port for increased peripheral performance
  • Single or dual Gigabit Ethernet options

Availability

The Procelerant CEQM57 module production shipment is anticipated in Q1 2010. To place an order or for more information, call 800-950-0044 or 503-615-1100.

About Procelerant COM Express

Radisys’ Procelerant COM Express products help equipment manufacturers shorten their time-to-market and reduce development costs. By removing the processor, chipset and memory from the rest of the design, manufacturers can focus engineering resources on developing differentiating features and avoid the design churn that comes with implementing new processor generations. Radisys also provides a wide range of COM Express Expert custom services that further accelerate customer time-to-market by supplying carrier concept definition and design, carrier schematic reviews, BIOS customization and thermal design.

About Radisys

Radisys (NASDAQ: RSYS) is a leading provider of embedded wireless infrastructure solutions for telecom, aerospace, defense and public safety applications. Radisys’ market-leading ATCA, IP Media Server and COM Express platforms coupled with world-renowned Trillium software, services and market expertise enable customers to bring high-value products and services to market faster with lower investment and risk. Radisys solutions are used in a wide variety of 3G & 4G / LTE mobile network applications including: Radio Access Networks (RAN) solutions from femtocells to picocells and macrocells, wireless core network applications, Deep Packet Inspection (DPI) and policy management; conferencing and media services including voice, video and data, as well as customized mobile network applications that support the aerospace, defense and public safety markets.

Radisys, Continuous Computing and Trillium are registered trademarks of Radisys Corporation.