Radisys Announces Graphics and Processing-Intensive COM Express Module, Supporting Latest Intel Processors

Radisys’ CEQM77, with third-generation Intel Core i7 processing, enables video applications in the medical and enterprise markets to be brought into smaller more efficient space designs

HILLSBORO, OR, U.S. – May 29, 2012 - Radisys Corporation (NASDAQ: RSYS), a leading provider of embedded wireless infrastructure solutions, today announced the CEQM77 family of ultra-portable COM Express modules, based on third-generation Intel Core i7 processors, to support higher processing and graphics performance for video-intensive applications. The CEQM77 combines quad and dual-core performance, the option for error correcting code (ECC) memory and a ruggedized COM Express module with a -40C to +85C temperature range to meet demanding requirements for embedded technology applications in the medical and enterprise markets.

Within the A&D market, today’s military systems are demanding higher processing and graphics capabilities to ensure optimal situational awareness on the battlefield as well as ECC memory to ensure data integrity for mission critical applications. These consolidated systems must meet stringent size, weight and power restrictions while providing the processing capacity to combine legacy computers that support multiple, high-quality displays. Radisys’ extended-temperature -40C to +85C CEQM77 module with ECC memory is specifically designed and tested to withstand extreme military conditions and meet the processing-intensive needs for these applications.

“The rapid evolution of A&D applications requires us to stay on top of the technology curve and we rely heavily on our suppliers to provide the innovative solutions that will keep us moving forward,” said David Gutman, President and COO, Tulip Development Labs, a world class provider of shock, vibration and environmentally-rugged in-vehicle or aircraft mounted LCD displays. “Radisys consistently provides access to the newest silicon offerings on industry-standard COM Express modules, allowing us to offer our customers the performance they need for their mission critical applications, as well as a quick upgrade path without significant engineering costs.”

Supporting the third-generation Intel Core i7 processors such as the quad-core 2.3GHz 3615QE, Radisys’ CEQM77 provides a 20 percent processing performance increase and twofold graphics acceleration over the previous generation module, all while extending the product lifetime and maintaining a smooth upgrade path for previous COM Express based applications.

“The combination of ruggedness, reliability and performance in Radisys’ COM Express modules enables our customers to implement an entire system or network that can be picked up and moved to meet changing battlefield situations,” said Jennifer Zickel, COM Express product line manager, Radisys. “For example, by combining Radisys Trillium 3G and LTE wireless software with our COM Express portfolio we are enabling ruggedized portable wireless end-to-end communications networks, including the full core network, in a 60mm x 120mm x 150mm package. In addition, our Software Media Server performs multimedia packet processing for real-time communication applications in the battlefield, like push-to-talk services over ad-hoc cellular networks.”

About CEQM77

Radisys’ CEQM77 module combines the latest graphics technology and processing improvements, meeting the needs of applications such as in-vehicle systems, test and measurement, medical imaging and network enterprise systems. Key product features include:

  • Quad-core, third-generation Intel Core i7 processor options
    • Intel Quad Core i7 3615QE processor, 2.3GHz
    • Intel Quad Core i7 3612QE, 2.1GHz
  • Type 6 COM Express Revision 2.0 extended temperature module
  • Basic 95mm x 125mm size
  • HD400 Intel Graphics Controller supporting DirectX 11 and OpenGL
  • Intel QM77 chipset for up to eight USB ports, four SATA ports and DDI, HDMI, LVDS or VGA graphics
  • Support for up to three independent displays
  • One PCI Express 3.0 x16 PEG port and seven PCI Express 2.0 x1 ports
  • Up to 16GB DD3 memory including ECC support for enterprise and A&D applications
  • Radisys embedded software platform support encompassing extensible firmware interface (EFI) pre-boot environment applications, user BIOS customization tools and standardized application programming interfaces (APIs)

The CEQM77 is available in the commercial (0C to 60C) or extended (-45C to +85C) temperature ranges, with or without ECC memory support. Radisys CEQM77 product samples are available now and are expected for general availability in July 2012. To place an order or to receive more information, call +1 800-950-0044 or +1 503-615-1100.

Additional Resources

About Radisys

Radisys (NASDAQ: RSYS), a global leader in open telecom solutions, enables service providers to drive disruption with new open architecture business models. Radisys’ innovative disaggregated and virtualized enabling technology solutions leverage open reference architectures and standards, combined with open software and hardware to power business transformation for the telecom industry, while its world-class services organization delivers systems integration expertise necessary to solve communications and content providers’ complex deployment challenges.

Radisys, Continuous Computing and Trillium are registered trademarks of Radisys Corporation.