Terms of Use

Copyright and Legal Notices

These materials are provided by RadiSys Corporation ("RadiSys") as a service to its customers and may be used for informational purposes only. Single copies may be downloaded subject to the provisions below. By downloading any materials from this site, you agree to these terms. If you do not agree to them, do not use the site or download any materials from it.

Trademark Information

EPC and RadiSys are registered trademarks of RadiSys Corporation. ASM, Brahma, DAI, DAQ, MultiPro, Procelerant, Promentum, SAIB, Spirit, and ValuePro are trademarks of RadiSys Corporation.

DAVID, HawkEye, MAUI, OS-9, OS-9000 and SoftStax are registered trademarks of RadiSys Microware Communications Software Division, Inc. FasTrak, Hawk, and UpLink are trademarks of RadiSys Microware Communications Software Division, Inc.

RadiSys' trademarks may be used publicly with permission only from RadiSys. Fair use of RadiSys' trademarks in advertising and promotion of RadiSys products requires proper acknowledgement.

*All other brands and names are property of their respective owners.

Third Party Notices

Product variants designed with the Intel® 915GM/945GM Express chipsets within the Procelerant™ COM Express and Endura motherboard product families incorporate copy protection technology that is protected by U.S. and foreign patents, including patent numbers 5,315,448 and 6,836,549, and other intellectual property rights. The use of Macrovision's copy protection technology in the product must be authorized by Macrovision. Reverse engineering or disassembly is prohibited.

Single Copy License

You may download one copy of the information or software ("Materials") found on RadiSys sites on a single computer for your personal, non-commercial internal use only. This is a license, not a transfer of title, and is subject to the following restrictions: you may not: (a) modify the Materials or use them for any commercial purpose, or any public display, performance, sale or rental; (b) decompile, reverse engineer, or disassemble software Materials; (c) remove any copyright or other proprietary notices from the Materials; (d) transfer the Materials to another person. You agree to prevent any unauthorized copying of the Materials.

Ownership of Materials

Materials are copyrighted and are protected by worldwide copyright laws and treaty provisions. They may not be copied, reproduced, modified, published, uploaded, posted, transmitted, or distributed in any way, without RadiSys' prior written permission. Except as expressly provided herein, RadiSys does not grant any express or implied right to you under any patents, copyrights, trademarks, or trade secret information. Other rights may be granted to you by RadiSys in writing or incorporated elsewhere in the Materials.

Termination of This License

RadiSys may terminate this license at any time if you are in breach of the terms of this Agreement. Upon termination, you will immediately destroy the Materials.

Disclaimer

THE MATERIALS ARE PROVIDED "AS IS" WITHOUT ANY EXPRESS OR IMPLIED WARRANTY OF ANY KIND INCLUDING WARRANTIES OF MERCHANTABILITY, NONINFRINGEMENT OF INTELLECTUAL PROPERTY, OR FITNESS FOR ANY PARTICULAR PURPOSE. IN NO EVENT SHALL RADISYS OR ITS SUPPLIERS BE LIABLE FOR ANY DAMAGES WHATSOEVER (INCLUDING, WITHOUT LIMITATION, DAMAGES FOR LOSS OF PROFITS, BUSINESS INTERRUPTION, LOSS OF INFORMATION) ARISING OUT OF THE USE OF OR INABILITY TO USE THE MATERIALS, EVEN IF RADISYS HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. BECAUSE SOME JURISDICTIONS PROHIBIT THE EXCLUSION OR LIMITATION OF LIABILITY FOR CONSEQUENTIAL OR INCIDENTAL DAMAGES, THE ABOVE LIMITATION MAY NOT APPLY TO YOU. RadiSys further does not warrant the accuracy or completeness of the information, text, graphics, links or other items contained within these materials. RadiSys may make changes to these materials, or to the products described therein, at any time without notice. RadiSys makes no commitment to update the Materials.

U.S. Government Restricted Rights

The Materials are provided with "RESTRICTED RIGHTS." Use, duplication, or disclosure by the Government is subject to restrictions as set forth in FAR52.227-14 and DFAR252.227-7013 et seq. or its successor. Use of the Materials by the Government constitutes acknowledgment of RadiSys' proprietary rights in them.

Applicable Laws

This site is controlled and operated by RadiSys from its offices within the United States of America. RadiSys makes no representation that Materials in the site are appropriate or available for use in other locations, and access to them from territories where their contents are illegal is prohibited. Those who choose to access this site from other locations do so on their own initiative and are responsible for compliance with applicable local laws. You may not use or export the Materials in violation of U.S. export laws and regulations. Any claim relating to the Materials shall be governed by the internal substantive laws of the State of Delaware.

Forward Looking Disclosure

Except for the historical information, the matters discussed in this web site, including statements regarding expectations of future operating performance, future development and business activities, expectations of future orders, future revenues and earnings, and estimated revenues and earnings from design wins, are forward-looking statements that involve risks and uncertainties. The following are among the factors that could cause actual results to differ materially: general business and economic conditions in the markets RadiSys serves, particularly the communications market; changes in customer order patterns or inventory levels; dependence on the relationship with Intel Corporation and its products; lower than expected or delayed sales by our customers in the communications market; lower than expected design wins with key OEMs; failure of leading OEMs to incorporate RadiSys' solutions in successful products; schedule delays or cancellations in design wins; execution of the development or production ramp for design wins; inability to successfully integrate acquired businesses and assets, deliveries of products containing errors, defects and bugs; dependence on a limited number of suppliers or, in some cases, one supplier for components and equipment used to manufacture products; competition in the embedded computer market, which may lead to pricing pressures; political, economic and regulatory risks associated with international operations; technological developments; the inability to protect RadiSys' intellectual property or successfully to defend against infringement claims by others; availability of qualified personnel; technological difficulties and resource constraints encountered in developing new products; and difficulty or inability to meet obligations to repay indebtedness, as well as factors specified from time-to-time in our SEC filings, including our most recent Annual Report on Form 10-K. The forward-looking statements should be considered in light of these factors.