COM Express Webinars

  • German Web Seminars
  • These web seminars are also available in German. Click here for more info and to register.
  • COM Express Technology Spotlight
  • COM Express RadiSys is a leader in COM Express. Find out more about Computer-On-Module technology and our Procelerant™ products.

    • Moore’s Law, Thermal Management and Rocket Science

    Abstract:Moore's law is driving processor density and performance, and along with it - the thermal envelope. Thermal management has quickly become a critical piece of system design, requiring hours of simulation time and specialized expertise.

    COM Express enables an upgradeable, modular solution - but the thermal management is no less complicated than before – it is rocket science. RadiSys will present representative examples of good thermal management practices and poor thermal management practices – applicable techniques for COM Express or any board design.

    Featured Speaker: Israel Dubin, Mechanical Engineer

    Successful Carrier Card Design for COM Express – Introduction to High Speed Serial Bus Interface Design

    Abstract: The carrier card is an essential element of any system solution built around the COM (Computer on Module) concept. With the new PICMG COM Express standard, board designers may be facing some unprecedented challenges using the latest technology high-speed serial bus interfaces.

    Developers are invited to join RadiSys for a invaluable tutorial covering the bus and I/O interfaces, major design rules, and key tips to making a COM Express carrier design successful. Andrew Pitt, COM Express Applications Engineer, will share RadiSys design experiences that will enable customers to eliminate the risk of developing their own carrier using the new serial bus technology.

    Know What You Are Getting: COM Express, The PICMG Standard

    Abstract: The concept of a Computer on Module (COM) is not new to the embedded industry and today literally dozens of COM solutions and implementations are available. While innovative embedded applications benefit from the exceptional processing performance and I/O bandwidth available in extremely compact form factors, the industry fragmentation has caused more headaches than anything. Clearly, a standard to unite future embedded COM designs was needed.

    The COM Express specification from the PCI Industrial Computer Manufacturers Group (PICMG®) has emerged as the COM Express standard and is gaining industry momentum and acceptance. Products that adhere to the standard are available and embedded developers interested in improving time to market and time to revenue are invited to join RadiSys for a live, interactive webinar for more information on: