Radisys Partners With Nolam Embedded Systems To Bring Ruggedized COM Express Modules to VME, CompactPCI, VPX and Small Form Factors

Formal partnership via Radisys Alliance Partner Program delivers faster customer access to fully-integrated and ruggedized systems.

HILLSBORO, OR – February 22, 2010 – Radisys® Corporation (NASDAQ: RSYS), a leading global provider of application–ready software and hardware platforms, today announced that Nolam Embedded Systems has joined the Radisys Alliance Partner Program (RAPP) as a Gold member. Through this formal partnership, Nolam and Radisys will collaborate to provide ruggedized solutions for harsh–environment applications in the mil/aero, communications and transportation markets. Radisys’ Procelerant™ COM Express processor modules enable breakthrough processing performance, while Nolam Embedded Systems designs highly–reliable VME, CompactPCI, VPX and small form factor carrier boards. Combining a processor module with a uniquely designed carrier board can deliver a scalable and flexible way to create customized systems, but requires a unique expertise and knowledge base rarely available from a single company. By bringing together their individual expertise, a formal Radisys and Nolam collaboration results in customers gaining quick access to a broad range of board and ruggedized solutions, which can save months of design and development time.

“In today’s competitive landscape, original equipment manufacturers must reduce their time–to–market while delivering innovative solutions that are flexible and scalable,” said Keate Despain, Senior Director, Commercial Business Unit, Radisys. “As a new member of RAPP, Nolam Embedded Systems compliments our broad and deep ecosystem of industry–leading partners, giving our customers easy access to the benefits of an integrated and fully–validated ruggedized solution.”

Radisys’ Procelerant COM Express solutions are extensively tested for extended temperatures, offering the ideal processor module for Nolam’s ruggedized carrier boards such as CompactPCI, VME, small form factors and others. In addition to designing and integrating the Radisys processing module onto commercial off–the–shelf based carrier boards, Nolam also has the product–base knowledge of software services such as Board Support Packages (BSPs) for Real Time operating systems including Lynx, VxWorks, QNX, Linux Solaris and Windows XP/VISTA/Windows7. The Radisys–Nolam partnership provides customers with the expertise needed for every step of carrier board and system integration, saving them months of costly engineering resources upfront in their development process.

“Successfully introducing a ruggedized product to market requires proven expertise in design, integration and testing,” said Benjamin Nakache, Vice President Sales, Nolam Embedded Systems. “As an industry leader in designing and integrating both hardware and software for ruggedized applications, our expertise fittingly compliments Radisys’ extensive portfolio of extended temperature COM Express modules. Through a formal RAPP partnership, our customers can leverage our combined knowledge of embedded form factors to achieve their aggressive time–to–market goals.”

Radisys and Nolam will showcase their ruggedized solutions at Embedded World 2010, March 2–4 in Nuremberg, Germany, in the Nolam Embedded Systems Booth #9–144.

Radisys Alliance Partner Program

The Radisys Alliance Partner Program provides original equipment manufacturer customers with the broadest portfolio of standards–based building blocks in the industry that deliver choice and flexibility while significantly reducing development risk, time–to–market and cost. The breadth and depth of the Radisys ecosystem results in solutions that not only address the underlying technological issues associated with migration to next–generation platforms, but also address the business and service model requirements between partners delivering a comprehensive solution. Participants in RAPP include providers of solutions, application–specific stacks, silicon, hardware building blocks, operating systems and middleware as well as channel distributors and pre–sale and after–sale service providers.

About Radisys

Radisys (NASDAQ: RSYS) is a leading provider of embedded wireless infrastructure solutions for telecom, aerospace, defense and public safety applications. Radisys’ market-leading ATCA, IP Media Server and COM Express platforms coupled with world-renowned Trillium software, services and market expertise enable customers to bring high-value products and services to market faster with lower investment and risk. Radisys solutions are used in a wide variety of 3G & 4G / LTE mobile network applications including: Radio Access Networks (RAN) solutions from femtocells to picocells and macrocells, wireless core network applications, Deep Packet Inspection (DPI) and policy management; conferencing and media services including voice, video and data, as well as customized mobile network applications that support the aerospace, defense and public safety markets.

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