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The Procelerant® CEGSXT combines the next generation performance Intel® Core™ 2 Duo, Celeron® M processors and the GS45 chipset with RadiSys-designed dual channel memory to provide breakthrough processing performance on a basic size COM Express module. Featuring DDR3 memory and enhanced 3D graphics, the CEGSXT is available in both Type 2 and Type 3 COM Express pin-out options. The CEGSXT supports existing and new carrier designs while maximizing feature content.
RadiSys Extended Temperature products are designed with higher capability components and are subjected to an extensive suite of environmental tests to demonstrate capability of operation in -25C to +70C temperature range. With thorough design verification and 100% HASS screening, OEMs can depend on the sustained reliability of the Procelerant® CEGSXT in harsh, ruggedized environments as required by Military, Aerospace, Government, Transportation and Industrial Automation applications.
In addition to the custom BIOS and carrier design services, OEMs can depend on RadiSys for custom thermal consulting or design to support their extended temperature system design. RadiSys also offers Humiseal 1B31 conformal coating option for the CEGSXT. Ask your RadiSys Sales Manager for more information.
The greatest challenge companies face in adopting new technology is the difficulty they experience adapting it into their current products and also in utilizing it to its fullest advantage. Multi-core processing, one of the newest technological advances in COM Express modules, operates with the greatest efficiency when utilized with RadiSys Microware® Hypervisor middleware. One of the main benefits of Hypervisor's innovation is the ability to run legacy software on the latest-generation platforms without going through complex porting development. This saves time, and resources and total cost of ownership while advancing product features and functionality.
| Feature | Function | Description |
|---|---|---|
| Processor | SP9300 | 2.26 GHz Core™ 2 Duo SV processor / 6MB Cache / 1067MHz FSB /25W |
| SL9400 | 1.86 GHz Core™ 2 Duo SV processor / 6MB Cache / 1067MHz FSB /17W | |
| SU9300 | 1.2 GHz Core™ 2 Duo processor / 3MB Cache /800MHz FSB/10W | |
| ICP722 | 1.2 GHz Celeron® M processor / 1MB Cache / 800MHz FSB/5.5W | |
| Chipset | Intel GS45 Express and ICH9M I/O Hub | |
| Memory | Type | Two 204-pin right-angle SO-DIMM sockets for DDR3-1067 and DDR3-800 |
| Capacity | Up to 4GB per channel, for a maximum of 8GB memory | |
| Flash | 4MB system flash for BIOS storage | |
| Video | Intel® Gen 5.0 integrated graphics engine | Dual LVDS supports 2 x 18 bpp OR 2 x 24 bpp panel support |
| VGA | ||
| Default Output: SDTV/Standard Definition TV Also Supported: Composite, S-Video, Component Video, HDTV |
||
| Dual-channel SDVO, multiplexed on the PCI Express Graphic port display interface | ||
| Three DisplayPort, multiplexed on the PCI Express Graphic port display interface | ||
| External | One PCI Express x16 Graphics expansion port | |
| Networking | Type 2 | One 10/100/1000BaseT |
| Type 3 | Two 10/100/1000BaseT | |
| Audio | High Definition Audio | |
| Speaker Out | ||
| Storage | SATA | Four SATA interfaces, each capable of supporting one SATA device Supports both 1.5 and 3.0 Gbps operation |
| IDE (for type 2 only) | One IDE interface (build option) capable of supporting two UltraATA/100 devices | |
| PCI Express | Type 2 and 3 | One x16 PCI Express Graphics expansion port |
| Type 2 | One PCI Express x1 Interface Four x1 PCI Express link expansion ports, configurable as:
|
|
| Type 3 | Four x1 PCI Express link expansion ports, configurable as:
|
|
| PCI | One PCI 2.3 compliant 32-bit, 33MHz bus | |
| USB | Eight USB 2.0 expansion ports | |
| LPC | One LPC interface | |
| Power | +12 power rail, primary input Supports 6.0V-16.8V (SL9400, SP9300, SU9300, ICP722) Supports 6.0V-15.5V (T9400 only) |
|
| Power Management | ACPI 3.0 supporting states S0, S3, S4, S5, G3, and C0, C1, C2, C3, C4/C4E | |
| Miscellaneous | One SMBus | |
| Eight GPIO (four GPI and four GPO) | ||
| One I2C | ||
| BIOS | Phoenix® EmbeddedBIOS® with StrongFrame® Technology |
|
| OS | Windows XP® Embedded | |
| Windows XP® Professional | ||
| Windows Vista® Ultimate Edition | ||
| Red Hat® Enterprise Linux | ||
| RadiSys® Microware® OS-9 | ||
| Microware® Hypervisor | ||
| Physical Specifications | |||
|---|---|---|---|
| Physical | Dimensions | 95mm x 125mm | |
| Compliance | PICMG COM.0 COM Express R1.0 Basic Form Factor | ||
| Optional Conformal Coating | Humiseal 1B31 | ||
| Environment | Cooling | Forced air | Class EAC1 as defined in the ANSI/VITA 47-2005 |
| Conduction | Class ECC1 as defined in the ANSI/VITA 47-2005 | ||
| Temperature | Operating | Up to 2300m (7500ft) -25°C to +70°C, derated 1.1°C per 300m over 2300m |
|
| Non-operating | -40°C to +85°C | ||
| Shock | Operating | 40G, half sine shock pulse, 11ms duration, 3 times per face | |
| Non-Operating/Unpacked | 50G, half sine shock pulse, 11ms duration, 3 times per face | ||
| Transportation/Packaged | Fixtured assembly: 50G, 17.4 ms trapezoidal pulse Drop test, 10-up bulk packaging, 30in free-fall, one drop on each of six faces |
||
| Vibration (random) |
Operating | Random 5Hz to 2KHz, 12.07 grms, 1hr in each of 3 axes 5Hz - 40Hz: 0.04g2/Hz 40Hz to 100Hz: 0.04g2/Hz ramping up to .01g2/Hz(3dB/oct) 100Hz - 1000Hz: 0.1g2/Hz 1000Hz - 2000Hz 0.1g2/Hz ramping down to 0.025g2/Hz (6dB/oct) |
|
| Non-Operating/Storage | Random 5Hz to 2KHz, 12.07 grms, 1hr in each of 3 axes 5Hz - 40Hz: 0.04g2/Hz 40Hz to 100Hz: 0.04g2/Hz ramping up to 0.1g2/Hz (3dB/oct) 100Hz to 1000Hz 0.1g2/Hz 1000Hz - 2000Hz 0.1g2/Hz ramping down to 0.025g2/Hz (6db/oct) 5 - 500Hz swept sine, 2.5 (0-p), 25.4mm(p-p) MAX displacement, 5 min dwell at 3 resonances in each of 3 axes |
||
| Humidity | Operating | 5% to 95% non-condensing. 95%RH@30C, linear derating to -25°C to +70°C | |
| Non-Operating/Storage | 5% to 95% non-condensing | ||
| Altitude | Operating | To 15,000ft (4570m) Up to 2300m (7500 ft), -25°C to +70°C Derated -1.1 C per 305 m (1000 ft) above 2300 m (7500 ft) |
|
| Non-Operating/Storage | To 40,000ft (12000m) | ||
| Regulatory | Safety | UL60950-1, EN60950-1, IEC60950-1 | |
| Shall meet RoHS at time of production | |||
| EMC | EN55024, EN55022, and FCC Part 15, Subpart B, Class B |
||
| Warranty | Standard | Two years, parts only | |
Module Order Codes:
CEGSXTT2-SP9-0: Type2, -25C to +70C, 2.26GHz Core™ 2 Duo SP9300 SV, Computer
CEGSXTT3-SP9-0: Type3, -25C to +70C, 2.26GHz Core™ 2 Duo SP9300 SV, Computer
CEGSXTT2-SL9-0: Type2, -25C to +70C, 1.86GHz Core™ 2 Duo SL9400 LV, Computer
CEGSXTT2-SU9-0: Type2, -25C to +70C, 1.2GHz Core™ 2 Duo SU9300 ULV, Computer
CEGSXTT2-722-0: Type2, -25C to +70C, 1.2GHz Celeron® 722 ULV, Computer
Supporting Products:
CR202-PCIE16: Type 2, ATX development carrier, PCI Express x16
CR203-VGA: Type 3, ATX development carrier, VGA
CEGSXT-AHS: CEGSXT active heatsink assembly
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