CEQM57XT
Type 2, 95x125mm COM, Intel 1st Generation Core i7 Processor, XT
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The CEQM57 combines the next generation performance Intel® Core™ i5 and i7 processors and the Mobile Intel® QM57 Express chipset with Radisys -25C to +70C extended temperature range specifications to provide breakthrough processing performance on a ruggedized basic size COM Express module.
The CEQM57XT combines the next generation performance Intel® Core™ i5 and i7 processors and the Mobile Intel® QM57 Express chipset with Radisys -25C to +70C extended temperature and vibration specifications to provide breakthrough processing performance on a ruggedized COM Express module. The basic size 95mm x 125mm module is ideal for compute intensive applications such as military–aerospace, transportation and industrial applications requiring high levels of performance and durability. Radisys delivers the CEQM57XT module in a Type 2 pin out, enabling customers to easily upgrade from their previous generation module while boosting features and performance with up to 8GB memory, additional PCI Express lanes, and improved storage, graphics and audio.
The Radisys CE family of COM Express products enable customers to start designing at the same time as processor release, saving months of development time and resources. OEM focus can remain on core competencies such as software and application development rather than high speed circuit design. Planned feature changes, demand fluctuations and performance upgrades can be handled without product re–designs using the CE family. CE modules can reduce service repair inventories, and simplify upgrades, contributing to the success of the product over its lifetime.
EXTREME CAPABILITY AND SUSTAINED RELIABILITY
Radisys Extended Temperature products are designed with higher capability components and are subjected to an extensive suite of environmental tests to demonstrate capability of operation in -25C to +70C temperature range. With thorough design verification and 100% HASS screening, OEMs can depend on the sustained reliability of the CEQM57XT in harsh, ruggedized environments as required by Military, Aerospace, Government, Transportation and Industrial Automation applications.
COM EXPERT DESIGN SERVICES
OEMs can depend on the Radisys COM Expert team to support their design at every stage, from schematic checks to the handling of entire custom carrier and system designs. Radisys COM Expert services include options for software utilities, custom BIOS, mechanical models, debug assistance and more to customers using Radisys CE processor modules. Design consulting and debug services are also available to support OEM product development at any stage.
In addition to the custom BIOS and carrier design services, OEMs can depend on Radisys for custom thermal consulting or design to support their extended temperature system design. Radisys also offers Humiseal 1B31 conformal coating option for the CEQM57. Ask your Radisys Sales Manager for more information
- -25C to +70C Extended temperature range
- Intel® Core™ i5 and i7 Processor options
- Intel Core™ i7 610E 2.53GHz
- Intel Core™ i7 620L 2.0GHz
- Intel Core™ i7 620U 1.06GHz
- Mobile Intel® QM57 Express chipset
- Dual–channel DDR3, up to 8GB
- Type 2 pin–out
- TPM
- Six PCI Express x1 ports, one PCI Express x8 port
- Single or dual Gigabit Ethernet options
- Conformal Coat Option - Humiseal 1B31
| Feature | Function | Description |
| Pin-Out | Type | Type 2, 95mm x 125mm |
| Compliance | PICMG COM Express R1.0 Basic Form Factor | |
| Processor | 610E | Core™ i7 610E 2.53GHz / 4MB cache / 1067MHz FSB/ 35W |
| 620L | Core™ i7 620L 2.0GHz / 4MB Cache / 1067MHz FSB/ 25W | |
| 620U | Core™ i7 620U 1.06GHz / 4MB Cache / 800MHz FSB /18W | |
| Chipset | Mobile Intel® QM57 Express chipset | |
| Memory | Type | Two 204-pin right-angle SO-DIMM sockets for DDR3-1067 and DDR3-800. |
| Capacity | Up to 4GB per channel, for a maximum of 8GB memory | |
| Flash | 4MB system flash for BIOS storage | |
| Video | Intel® Gen 5.0 integrated graphics engine | Dual LVDS supports (2) 18 bit or (2) 24 bit panel support resolutions up to 1920x1200 pixels at 60 Hz |
| VGA | ||
| One SDVO interface (default) support resolutions up to 1920x1200 pixels at 60 Hz | ||
| External | Build option to support one x16 PCI Express interface for external PCIe x16 graphics device, Embedded Display Port eDP mux'ed with PEG interface | |
| Networking | Type 2 | One 10/100/1000BaseT |
| Type 3 (Build Option) | Two 10/100/1000BaseT | |
| Audio | High Definition Audio | |
| Speaker Out | ||
| Storage | SATA | 4 SATA ports supporting both 1.5 and 3.0 Gbps operation Supports RAID 0, 1, 5 and 10 |
| USB | One microSD socket (option) | |
| PCI Express | Six PCI Express x1 ports
(Build Option) One PCI Express x16 Graphics Expansion Port |
|
| PCI | One PCI 2.3 compliant 32-bit, 33MHz bus | |
| USB | Eight USB 2.0 expansion ports (Build Option for 4 additional USB 2.0 via on–board headers) |
|
| LPC | One LPC interface | |
| TPM | ATMEL AT97SC3204 | |
| Power | +12 power rail, primary input Supports 9.0V–16.8V power supply |
|
| Power Management | ACPI 3.0 supporting states G0/S0, G1/S3, G2/S5, and G3 | |
| Miscellaneous | One 100KHz SMBus from PCH | |
| One 400KHz I2C bus from MCU | ||
| Eight GPIO (four GPI and four GPO) | ||
| Watchdog timer | ||
| BIOS | AMI EFI Firmware | |
| OS | Windows XP® | Embedded Professional Professional 64bit |
| Windows Vista | Ultimate Edition Ultimate Edition 64bit |
|
| Windows 7 | Ultimate Edition Ultimate Edition 64bit |
|
| Red Hat Linux | Enterprise Enterprise 64bit |
|
| Microware® Hypervisor | ||
Physical Specifications
| Physical | Dimensions | 95mm x 125mm | |
| Compliance | PICMG COM Express R1.0 Basic Form Factor | ||
| Conformal Coat | Optional - Humiseal 1B31 | ||
| Environment | Cooling | Forced air | Class EAC1 as defined in the ANSI/VITA 47-2005 |
| Conduction | Class ECC1 as defined in the ANSI/VITA 47-2005 | ||
| Temperature | Operating | Up to 2300m (7500ft) -25°C to +70°C, derated 1.1°C per 300m over 2300m |
|
| Non-operating | -40°C to +85°C | ||
| Shock | Operating | 40G, half sine shock pulse, 11ms duration, 3 times per face | |
| Non-Operating/Unpacked | 50G, half sine shock pulse, 11ms duration, 3 times per face (unpackaged) | ||
| Transportation/Packaged | Fixtured assembly: 50G, 17.4 ms trapezoidal pulse Drop test, 10-up bulk packaging, 30in free-fall, one drop on each of six faces |
||
| Vibration (random) |
Operating | Random 5Hz to 2KHz, 12.07 grms, 1hr in each of 3 axes 5Hz - 40Hz: 0.04g2/Hz 40Hz to 100Hz: 0.04g2/Hz ramping up to .01g2/Hz(3dB/oct) 100Hz - 1000Hz: 0.1g2/Hz 1000Hz - 2000Hz 0.1g2/Hz ramping down to 0.025g2/Hz (6dB/oct) |
|
| Non-Operating/Storage | Random 5Hz to 2KHz, 12.07 grms, 1hr in each of 3 axes 5Hz - 40Hz: 0.04g2/Hz 40Hz to 100Hz: 0.04g2/Hz ramping up to 0.1g2/Hz (3dB/oct) 100Hz to 1000Hz 0.1g2/Hz 1000Hz - 2000Hz 0.1g2/Hz ramping down to 0.025g2/Hz (6db/oct) 5 - 500Hz swept sine, 2.5 (0-p), |
||
| Humidity | Operating | 5% to 95% non-condensing. 95%RH@30C, linear derating to 25%RH@70C | |
| Non-Operating/Storage | 5% to 95% non-condensing | ||
| Altitude | Operating | To 15,000ft (4570m) Up to 2300m (7500 ft), -25°C to +70°C Derated -1.1 C per 305 m (1000 ft) above 2300 m (7500 ft) |
|
| Non-Operating/Storage | To 40,000ft (12000m) | ||
| Regulatory | Safety | UL60950-1, EN60950-1, IEC60950-1 | |
| Shall meet RoHS at time of production | |||
| EMC | EN55024, EN55022, and FCC Part 15, Subpart B, Class B | ||
| Warranty | Standard | Two years, parts only | |
Module Order Codes:
- CEQMXT–610E–0: Core™ i7 610E 2.53GHz, 4MB cache, Type 2, single LAN, SDVO, TPM, -25C to +70C
- CEQMXT–620L–0: Core™ i7 620LE 2.0GHz, 4MB cache, Type 2, single LAN, SDVO, TPM, -25C to +70C
- CEQMXT–620U–0: Core™ i7 620UE 1.06GHz, 4MB cache, Type 2, single LAN,SDVO, TPM, -25C to +70C
Supporting Products:
- S–CEQM57XTE–AHS: Active heatsink assembly
- S-CE-2GB-DDR3XT: 1GB DDR3 SODIMM Memory, Extended Temp (-25 to +70C )
- S-CE-2GB-DDR3IT: 2GB DDR3 SODIMM Memory, Industrial Temp (-40 to +85C )
- -S-CE-4GB-DDR3IT: 4GB DDR3 SODIMM Memory, Industrial Temp (-40 to +85C )
Please contact your Radisys representative today.
Toll–Free: 800–950–0044
Phone: 503–615–1100
Support: 866–385–6167
For more information
(800) 950-0044
For support questions call 1-866-385-6167 or visit support downloads for this product