CEQM57
Type 2, 95x125mm COM, Intel 1st Generation Core i7 Processor
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The CEQM57 combines the next generation performance Intel Core i5 and i7 processors and the Mobile Intel QM57 Express chipset with Radisys design expertise to provide breakthrough processing performance on a basic size COM Express module.
The CEQM57 combines the next generation performance Intel Core i5 and i7 processors and the Mobile Intel QM57 Express chipset with Radisys design expertise to provide breakthrough processing performance on a basic size COM Express module. The compact 95mm x 125mm module is ideal for compute intensive applications such as medical imaging, communications, military–aerospace and test and measurement applications that require high levels of performance. Radisys delivers the CEQM57 module in a Type 2 and Type 3 pin out, enabling customers to easily upgrade from their previous generation module while boosting features and performance with up to 8GB memory, SSDDR3 options, additional PCI Express lanes, and improved storage, graphics and audio. The CEQM57 module can support error–correcting code (ECC) for applications where memory integrity is required.
The Radisys CE family of COM Express products enable customers to start designing at the same time as processor release, saving months of development time and resources. OEM focus can remain on core competencies such as software and application development rather than high speed circuit design. Planned feature changes, demand fluctuations and performance upgrades can be handled without product re–designs using the CE family. CE modules can reduce service repair inventories, and simplify upgrades, contributing to the success of the product over its lifetime.
COM EXPERT DESIGN SERVICES
OEMs can depend on the Radisys COM Expert team to support their design at every stage, from schematic checks to the handling of entire custom carrier and system designs. Radisys COM Expert services include options for software utilities, custom BIOS, mechanical models, debug assistance and more to customers using Radisys CE processor modules. Design consulting and debug services are also available to support OEM product development at any stage. Ask your Radisys Sales Manager for more information.
- Intel Core i5 and i7 Processor options
- Intel Core i7 610E 2.53GHz
- Intel Core i7 620LE 2.0GHz
- Intel Core i7 620UE 1.06GHz
- Intel Core i5 520E 2.4GHz
- Intel Celeron P4505 1.86GHz
- Mobile Intel QM57 Express chipset
- Dual–channel DDR3, up to 8GB
- Type 2 pin–out
- TPM
- Support for SSDDR (Solid State Disk on SODIMM form factor) for up to 32 GB NAND flash memory or up to 8 GB DDR3 memory
- Six PCI Express x1 ports, one PCI Express x8 port (or a build–option to support PCI Express x16 expansion port)
- Single or dual Gigabit Ethernet options
| Feature | Function | Description |
| Pin-Out | Type | Type 2, 95mm x 125mm |
| Compliance | PICMG COM Express R1.0 Basic Form Factor | |
| Processor | 610E | Core i7 610E 2.53GHz / 4MB cache / 1067MHz FSB/ 35W |
| 520E | Core i5 520E 2.4GHz / 3MB cache 1067MHz FSB / 35W | |
| 620L | Core i7 620L 2.0GHz / 4MB Cache / 1067MHz FSB/ 25W | |
| 620U | Core i7 620U 1.06GHz / 4MB Cache / 800MHz FSB /18W | |
| P4505 | Celeron P4505 1.86GHz / 2MB Cache / 1067MHz FSB /35W | |
| Chipset | Mobile Intel QM57 Express chipset | |
| Memory | Type | Two 204-pin right-angle SO-DIMM sockets for DDR3-1067 and DDR3-800. |
| Capacity | Up to 4GB per channel, for a maximum of 8GB memory | |
| Flash | 4MB system flash for BIOS storage | |
| SSDDR3 | Option for 1GB DDR3 + 8GB SSD Option for 2GB DDR3+ 8GB SSD |
|
| Video | Intel Gen 5.0 integrated graphics engine | Dual LVDS supports (2) 18 bit or (2) 24 bit panel support resolutions up to 1920x1200 pixels at 60 Hz |
| VGA | ||
| One SDVO interface (default) support resolutions up to 1920x1200 pixels at 60 Hz | ||
| External | Build option to support one x16 PCI Express interface for external PCIe x16 graphics device, Embedded Display Port eDP mux'ed with PEG interface | |
| Networking | Type 2 | One 10/100/1000BaseT |
| Type 3 (Build Option) | Two 10/100/1000BaseT | |
| Audio | High Definition Audio | |
| Speaker Out | ||
| Storage | SATA | 4 SATA ports supporting both 1.5 and 3.0 Gbps operation Supports RAID 0, 1, 5 and 10 |
| Other | SSDDR3 with 8-32GB NAND flash (option) | |
| USB | One microSD socket (option) | |
| PCI Express | Six PCI Express x1 ports
(Build Option) One PCI Express x16 Graphics Expansion Port |
|
| PCI | One PCI 2.3 compliant 32-bit, 33MHz bus | |
| USB | Eight USB 2.0 expansion ports (Build Option for 4 additional USB 2.0 via on–board headers) |
|
| LPC | One LPC interface | |
| TPM | Nuvoton (Windbond) WPCT210A - not available on P450 product | |
| Power | +12 power rail, primary input Supports 9.0V–16.8V power supply |
|
| Power Management | ACPI 3.0 supporting states G0/S0, G1/S3, G2/S5, and G3 | |
| Miscellaneous | One 100KHz SMBus from PCH | |
| One 400KHz I2C bus from MCU | ||
| Eight GPIO (four GPI and four GPO) | ||
| Watchdog timer | ||
| BIOS | AMI EFI Firmware | |
| OS | Windows XP | Embedded Professional Professional 64bit |
| Windows Vista | Ultimate Edition Ultimate Edition 64bit |
|
| Windows 7 | Ultimate Edition Ultimate Edition 64bit |
|
| Red Hat Linux | Enterprise Enterprise 64bit |
|
Physical Specifications
| Physical | Dimensions | 95mm x 125mm | |
| Compliance | PICMG COM Express R1.0 Basic Form Factor | ||
| Environment | Cooling | Forced air | Class EAC1 as defined in the ANSI/VITA 47-2005 |
| Conduction | Class ECC1 as defined in the ANSI/VITA 47-2005 | ||
| Temperature | Operating | Up to 2300m (7500 ft), 0 to 60C Derated -1.1 C per 305 m (1000 ft) above 2300 m (7500 ft) |
|
| Non-operating | -40°C to +85°C | ||
| Shock | Operating | 30G, half sine shock pulse, 11ms duration, 3 times per face | |
| Non-Operating/Unpacked | 40G, half sine shock pulse, 11ms duration, 3 times per face (unpackaged) | ||
| Transportation/Packaged | Fixtured assembly: 50G, 17.4 ms trapezoidal pulse Drop test, 10-up bulk packaging, 30in free-fall, one drop on each of six faces |
||
| Vibration (random) |
Operating | Random 5Hz to 2KHz, 7.7 grms, 10min in each of 3 axes 5Hz - 20Hz: 0.004g2/Hz ramping up to 0.04g2/Hz 20Hz to 1000Hz: 0.04g2/Hz 1000Hz to 2000Hz: 0.04g2/Hz ramping down to 0.01g2/Hz |
|
| Non-Operating/Storage | Random 5Hz to 2KHz, 9.7 grms, 10min in each of 3 axes 5Hz - 20Hz: 0.006g2/Hz ramping up to 0.06g2/Hz 20Hz to 1000Hz: 0.06g2/Hz 1000Hz to 2000Hz: 0.06g2/Hz ramping down to 0.02g2/Hz |
||
| Humidity | Operating | 5% to 95% non-condensing. 95%RH@30C, linear derating to 25%RH@60C | |
| Non-Operating/Storage | 5% to 95% non-condensing | ||
| Altitude | Operating | To 15,000ft (4570m) | |
| Non-Operating/Storage | To 40,000ft (12000m) | ||
| Regulatory | Safety | UL60950-1, EN60950-1, IEC60950-1 | |
| Shall meet RoHS at time of production | |||
| EMC | EN55024, EN55022, and FCC Part 15, Subpart B, Class B | ||
| Warranty | Standard | Two years, parts only | |
Module Order Codes:
- CEQM57–610E–0: Core i7 610E 2.53GHz, 4MB cache, Type 2, single LAN, SDVO, TPM
- CEQM57–520E–0: Core i5 520E 2.4GHz, 3MB cache, Type 2, single LAN, SDVO, TPM
- CEQM57–620L–0: Core i7 620LE 2.0GHz, 4MB cache, Type 2, single LAN, SDVO, TPM
- CEQM57–620U–0: Core i7 620UE 1.06GHz, 4MB cache, Type 2, single LAN,SDVO, TPM
- CEQM57-P450-0: Celeron P4505 1.86GHZ, 2MB cache, Type 2, Single LAN, SDVO, No TPM
Supporting Products:
- S–CEQM57XTE–AHS: Active heatsink assembly
- S–CE–1GB–DDR3: 1GB DDR3 SODIMM Memory
- S–CE–2GB–DDR3: 2GB DDR3 SODIMM Memory
- S–CE–4GB–DDR3: 4GB DDR3 SODIMM Memory
- S–CE–1DDR3+8SSD: SSDR with 1GB DDR3 and 8GBSSD
- S–CE–2DDR3+8SSD: SSDR with 2GB DDR3 and 8GBSSD
For more information
(800) 950-0044
For support questions call 1-866-385-6167 or visit support downloads for this product