CE8M
Type 2, 95x95mm COM, Intel Atom D525 Processor
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The Radisys CE8M COM Express Module is the innovative combination of Intel’s dual core D525 ATOM™ processors and the compact 95mm x 95mm standardized Type 2 COM Express form factor. The ATOM™ processor delivers unprecedented performance and ultra low power in the smallest COM Express R2.0 footprint possible.
The Radisys CE8M COM Express Module is the innovative combination of Intel’s dual core D525 ATOM™ processors and the space conscious 95mm x 95mm standardized Type 2 COM Express form factor. The ATOM™ processor delivers unprecedented performance and ultra low power in the smallest COM Express R2.0 footprint possible. Delivering 5-15watt power dissipation, up to 4GB SODIMM DDR3 memory, Gigabit Ethernet, LVDS flat pannel support and a DVI build option, the CE8M COM Express module is ideal for high volume, low power battery and mobile applications.
COMPACT FORM FACTOR
The CE8M is based on the 95mm x 95mm compact COM Express form factor and still provides 4GB of DDR3 memory capacity to keep up the performance of Intel’s dual core D425 or D525 ATOM processors. The COM Express Type 2 board-to-board connectors are specified for serial differential signaling technologies such as PCI Express, Serial ATA, USB 2.0, LVDS, and optional DVI.
CE8M enables designers of battery powered applications to start designing at the same time as processor release, saving months of development time and resources. OEMs can focus on core competencies such as software and application development rather than high speed circuit design. Planned feature changes, demand fluctuations and performance upgrades can be handled without product re-designs using the CE8M. The CE8M can reduce service repair inventories, and simplify upgrades, contributing to the success of the product over its lifetime.
DESIGN SERVICES BY THE COM EXPERTS AT RADISYS
OEMs can depend on Radisys to support their design at every stage, whether it is carrier board design or services such as schematic reviews, debug assistance and custom BIOS generation. Carrier design tools such as the COM Express Design Guidelines, carrier schematics and Gerber files are available for customers committed to using Radisys CE modules. Carrier design consulting and debug services are also available to support OEM product development at any stage. Ask your Radisys Sales Manager for more information.
- 1.8GHz and 1.6GHz dual and single core Intel ATOM processor
- 95mm x 95mm COM Express Compact Type 2 pin-out
- Five PCIE x 1 or one PCIE x 4 and one PCIE x1 slots
- One 32-bit/33MHz PCI bus
- Up to 4GB DDR3 SODIMM memory
- Gigabit ethernet interface
- 18-bit LVDS and VGA support
- DVI and 24-bit LVDS build option
| Feature | Function | Description |
|---|---|---|
| Pinout | Type 2 COM Express, 95mm x 95mm | |
| Processor | Intel® ATOM™ Processor D525: 1.8GHz, 1M cache, 13W Intel® ATOM™ Processor D425: 1.8GHz, 512K cache, 10W Intel® ATOM™ Processor N455: 1.66GHz, 512K cache, 6.5W |
|
| Chipset | Intel® 82801HB I/O Controller (ICH8-M) | |
| Memory | Type | One DDR3 SODIMM socket, up to 800MHz |
| Capacity | Up to 4GB memory | |
| Flash | Optional SATA SSD build option, up to 32GB | |
| Video | Intel® Atom Integrated Graphics | Single channel 18-bit LVDS interface or simulated 24-bit LVDS via build option Support resolutions up to 2048 x 1536 pixels at 60Hz, 32-bpp VGA interface |
| Optional DVI interface build option Supports resolutions up to 1366 x 768 pixels |
||
| Networking | Optional 10/100/1000 Base-T | |
| Audio | High Definition Audio | |
| Speaker Out | ||
| Storage | SATA | 3 SATA interfaces Supports both 1.5 and 3.0 Gbps operation |
| IDE | One IDE interface capable of supporting two Ultra ATA/100 devices | |
| PCI Express | Five x1 PCI Express link expansion ports configurable as one x4 PCIE and one x1 PCIE link expansion ports | |
| PCI | One 32-bit/33MHz PCI bus for up to 4 PCI devices | |
| USB | Eight USB 2.0 expansion ports | |
| LPC | One LPC interface | |
| SPI | One SPI interface | |
| Power | +12 power rail | |
| Power Management | ACPI 3.0 supporting states S0, S3, S4, S5, G3, and C0, C1, C2, C3, C4/C4E | |
| Miscellaneous | One SMBus interface | |
| One I2C bus interface | ||
| Eight GPIO (four GPI and four GPO) | ||
| BIOS | AMI BIOS | |
| Operating System | Windows XP® SP3 (32-bit) | |
| Windows 7 (32-bit) | ||
| Windows Embedded Standard 7 (32-bit) | ||
| Windows CE® 6.0 R3 | ||
| Ubuntu LTS 10.04 | ||
| Physical Specifications | |||
|---|---|---|---|
| Physical | Dimensions | 95mm x 95mm | |
| Compatibility | Compliant with the PICMG COM 1.0 COM Express, Type 2 pinout | ||
| Environment | Cooling | Forced air | Class EAC1 as defined in the ANSI/VITA 47-2005 |
| Conduction | Class ECC1 as defined in the ANSI/VITA 47-2005 | ||
| Temperature | Operating | 0°C – 60°C, derated 1.1°C per 300m over 2300m | |
| Non-operating | -40°C – +85°C | ||
| Shock | Operating | 30G, half sine shock pulse, 11ms duration 3 times per face | |
| Non-Operating/Unpacked | 40G, half sine shock pulse, 11ms duration 3 times per face | ||
| Transportation/Packaged | Fixtured assembly: 50G, 17.4 ms trapezoidal pulse Drop test, 10-up bulk packaging, 30in free-fall, one drop each of six faces |
||
| Vibration | Operating | Random 5Hz to 2KHz, 7.7 grms, 10min in each of 3 axes 5 – 20Hz 0.004g2/Hz ramping up to 0.04g2/Hz 20 – 1000Hz 0.04g2/Hz 1000Hz - 2000Hz 0.04g2/Hz ramping down to 0.01g2/Hz |
|
| Non-Operating/Storage | Random 5Hz – 2KHz, 9.7 grms, 10min in each of 3 axes 5 – 20Hz 0.006g2/Hz ramping up to 0.06g2/Hz 20Hz – 1000Hz 0.06g2/Hz 1000Hz – 2000Hz 0.06g2/Hz ramping down to 0.02g2/Hz |
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| Humidity | |||
| Operating | 5% to 95% non-condensing. 95%RH@30C, linear derating to 25%RH@70C | ||
| Non-Operating/Storage | 5% to 95% non-condensing | ||
| Altitude | Operating | To 15,000ft (4570m) | |
| Non-Operating/Storage | To 40,000ft (12000m) | ||
| Regulatory | Safety | UL60950-1, EN60950-1, IEC60950-1 | |
| RoHS at time of production | |||
| EMC | EN55022, EN55024, and FCC Part 15, Subpart B, Class B | ||
| Warranty | Standard | Two years, parts only | |
MODULE ORDER CODES:
CE8M-D525-0 Type 2, 1.8GHz D525 ATOM
CE8M-D425-0 Type 2, 1.8GHz D425 ATOM
CE8M-N455-0 Type 2, 1.66GHz N455 ATOM
SUPPORTING PRODUCTS:
CR202-PCIE16: Type 2, ATX Development Carrier
CE8M-AHS: Active Heatsink Assembly for D525
CE8M-PHS Passive Heatsink Assembly for D425 and N455
Please contact your Radisys representative today.
Toll–Free: 800–950–0044
Phone: 503–615–1100
Support: 866–385–6167
For more information
(800) 950-0044
For support questions call 1-866-385-6167 or visit support downloads for this product