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02/01/2012

Radisys® Corporation today announced the CEQM67HD, the first ruggedized COM Express module with quad-core Intel® Core™ i7 processing and a -40 C to +85 C temperature range.

10/19/2011

Today, BTS™ Corporation and Radisys® Corporation held a live demonstration of their interoperable products – CoreTx™ and Trillium® small cell software – at BTS Network Solutions’ headquarters in Columbia, MD.

03/10/2011

RadiSys® Corporation today announced that the company has registered and is in compliance with International Traffic in Arms Regulations (ITAR) administered by the United States Department of State Directorate of Defense Trade Controls (DDTC).

01/20/2011

RadiSys® Corporation today announced it will demonstrate its latest AdvancedTCA (ATCA) and COM Express solutions at AFCEA West 2011, to be held January 25-27 in San Diego, Calif.

01/05/2011

RadiSys® Corporation today announced the release of its Procelerant™ CEQM67, a breakthrough, quad-core performance Type 6 COM Express Revision 2.0 module based on the 2nd generation Intel® Core™ i7 processor at 2.1GHz and Intel® QM67 Express chipset.

10/29/2010

RadiSys Corporation today announced that it will showcase AdvancedTCA (ATCA) and COM Express solutions at MILCOM 2010, to be held October 31-November 3, 2010 in San Jose, Calif.

09/01/2010

RadiSys® Corporation (NASDAQ: RSYS), a leading provider of innovative hardware and software platforms for next generation IP-based wireless, wireless and video networks, today announced its endorsement of the PICMG Computer-On-Module (COM) Express 2.0 specification. The COM Express 2.0 specification builds on the success of the COM Express 1.0 specification, supporting new interfaces while addressing obsolescence issues with existing interfaces. Applications that will benefit from these new features include transaction terminals, digital signage, medical devices and certain video-intensive applications in the mil/aero market such as radar or imaging equipment.

08/19/2010

RadiSys® Corporation (NASDAQ: RSYS), a leading provider of innovative hardware and software platforms for next generation IP-based wireless, wireline and video networks, today announced that it will jointly demonstrate next-generation AdvancedTCA (ATCA) and COM Express solutions with key industry partners at AUVSI's Unmanned Systems North America 2010 to be held August 24-27, 2010 in Denver, Colo. The Association for Unmanned Vehicle Systems International's (AUVSI) annual show is the premiere forum for reviewing, assessing and discussing the successes and shortcomings of current unmanned systems.

06/08/2010

RadiSys® Corporation (NASDAQ: RSYS), a leading provider of innovative hardware and software platforms for next generation IP–based wireless, wireline and video networks, today announced the release of Microware® OS–9 5.0, a major update to its high–performance, high–availability real–time operating system (RTOS). The new OS–9 5.0 enables RadiSys customers to extend the lifecycle of product offerings via the latest embedded processors.

03/16/2010

RadiSys® Corporation (NASDAQ: RSYS), a leading global provider of application–ready software and hardware platforms, today announced the release of its second–generation Procelerant™ RMS420–5520DT, a high–performance embedded server platform now available with the newly–unveiled Intel® Xeon® processor 5600 series

02/26/2010

RadiSys® Corporation (NASDAQ: RSYS), a leading global provider of application–ready software and hardware platforms, today announced it will demonstrate its industry–leading COM Express modules and ATCA platforms for mil/aero, medical, industrial and communications applications at Embedded World, March 2–4, in Nuremberg, Germany.

02/25/2010

RadiSys® Corporation (NASDAQ: RSYS), a leading global provider of application–ready software and hardware platforms, today announced that IFTEST joined the RadiSys Alliance Partner Program (RAPP) as a Gold member to deliver customized COM Express carrier boards for the medical and industrial markets. RadiSys' COM Express processor modules enable breakthrough processing performance, while IFTEST provides custom carrier design services, including production, verification and testing.

02/24/2010

RadiSys® Corporation (NASDAQ: RSYS), a leading global provider of application–ready software and hardware platforms, today announced the extension of its processor offering on the Procelerant™ CEGM45 Com Express module, with the addition of the P8400 and T3100 Intel® Core™ 2 Duo processors. RadiSys now provides the widest range of performance available for the Intel® GM45 generation of chipset.

02/23/2010

RadiSys® Corporation (NASDAQ: RSYS), a leading global provider of application–ready software and hardware platforms, today announced the release of its ruggedized Procelerant™ CEQM57XT COM Express module for deployment in harsh mil/aero and industrial environments. The CEQM57XT module combines the Intel® Core™ i7 and i5 processors and the Mobile Intel® QM57 Express chipset with extended temperature range from –25 to 70 degrees Celsius and ruggedized vibration specifications that are required for many mil/aero and industrial applications such as ruggedized computers/tablets, unmanned vehicles/robots and in–vehicle computers.

02/23/2010

RadiSys® Corporation (NASDAQ: RSYS), a leading global provider of application–ready software and hardware platforms, today announced that Nolam Embedded Systems has joined the RadiSys Alliance Partner Program (RAPP) as a Gold member. Through this formal partnership, Nolam and RadiSys will collaborate to provide ruggedized solutions for harsh–environment applications in the mil/aero, communications and transportation markets.

01/08/2010

RadiSys® Corporation (NASDAQ: RSYS), a leading global provider of embedded solutions for telecommunications, medical and other industries, today announced the release of its Procelerant™ CEQM57 COM Express module, utilizing the new Intel® Core™ i5 and i7 processors and the Mobile Intel® QM57 Express chipset. The CEQM57 COM Express high performance module features improved PCI Express bandwidth, graphics, storage and security features that directly impact compute intensive applications.

03/03/2009

RadiSys Announces Portfolio of Extended Temperature, Ruggedized Procelerant™ COM Express™ Modules Based On Intel® Processors